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MCP2515-I/MLVAO

Microchip Technology

MCP2515-I/MLVAO by Microchip Technology

MCP2515-I/MLVAO by Microchip Tech is a Serial Comm Controller with 5.5V max supply, 40MHz clock freq, and 0.125 MBps data rate. Ideal for CAN bus communication in automotive applications due to AEC-Q100 screening, -40 to 85 °C temp range, and SPI bus compatibility.

Median Price

$1.960

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.960

100+ parts

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1k+ parts

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500

$1.960

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Vyrian

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

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1,092

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,312 parts In-Stock

1+ parts

$1.960

100+ parts

-

1k+ parts

-

10k+ parts

$1.921

5,312

$1.960

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-

$1.921

Argo Parts USA

USA . 179 parts In-Stock

1+ parts

$1.960

100+ parts

-

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179

$1.960

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Semicontronic

India . 276 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

276

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 342 parts In-Stock

1+ parts

$10.004

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342

$10.004

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Ampacity Inc.

Singapore . 592 parts In-Stock

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$17.000

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592

$17.000

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Corohmni

South Africa . 435 parts In-Stock

1+ parts

$26.857

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435

$26.857

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Aztec Data Supply Inc.

USA . 4,322 parts In-Stock

1+ parts

$82.980

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4,322

$82.980

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$83.809

100+ parts

$79.619

1k+ parts

$79.619

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3,000

$83.809

$79.619

$79.619

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Marpe Global Electronics

Taiwan . 7,298 parts In-Stock

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7,298

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QualityLine Systems

Poland . 5,176 parts In-Stock

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5,176

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XL Components Corporation

Australia . 1,687 parts In-Stock

1+ parts

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1,687

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$1.921

1k+ parts

$1.862

10k+ parts

$1.823

500

-

$1.921

$1.862

$1.823

Overview

Experience seamless and reliable communication with the MCP2515-I/MLVAO from Microchip Technology. As a leader in serial communication controllers, Microchip guarantees top-notch quality and performance. This versatile chip is perfect for various applications, providing high-speed data transfer and low power consumption. Say goodbye to connectivity issues and embrace the benefits of this innovative solution. Trust Microchip to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures longevity and ease of handling.

Surface Mount: YES

Compatibility with surface mount technology makes it easier to integrate into various electronic devices.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Sufficient on-chip data RAM width for efficient data processing and storage.

Screening Level: AEC-Q100

Compliance with AEC-Q100 automotive electronic component reliability standards ensures high quality and reliability.

Package Shape: SQUARE

Square package shape is space-efficient and facilitates easier mounting on PCBs.

No. of Terminals: 20

Adequate number of terminals for connecting to external devices and components.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package style options provide flexibility in terms of heat dissipation and space constraints.

Minimum Supply Voltage: 4.5 V

Wide range of supply voltage support allows for compatibility with various power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliability in harsh environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

Fast data transfer rate enables quick and efficient communication between devices.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for reliable operation in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for terminal connections.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connections.

Maximum Seated Height: 1 mm

Low seated height allows for compact designs with minimal space requirements.

RAM Words: 14

Sufficient RAM capacity for storing and processing data efficiently.

Width: 4 mm

Narrow width makes it suitable for applications with space constraints.

Data Encoding or Decoding Method: NRZ

NRZ encoding/decoding method ensures reliable data transmission without signal level changes.

Communication Protocol: SYNC; BIT ;BYTE

Support for various communication protocols enables compatibility with different devices and systems.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for speedy data processing and communication.

Length: 4 mm

Compact length for space-efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, CAN

Peripheral IC type designed for serial communication controller and CAN bus applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safe handling.

Maximum Supply Current: 10 mA

Low maximum supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance.

Bus Compatibility: SPI

SPI bus compatibility allows for easy integration with SPI-enabled devices.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise and secure connections.

Low Power Mode: YES

Low power mode feature for energy-saving operation and extended battery life.

Technical Specifications

Serial Communication Controllers MCP2515-I/MLVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Low Power Mode:

YES

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

20

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

14

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

MCP2515-I/MLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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