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MCP2518FDT-E/QBBVAO

Microchip Technology

MCP2518FDT-E/QBBVAO by Microchip Technology

MCP2518FDT-E/QBBVAO by Microchip: Operates at 2.7-5.5V, 1 MBps data rate, -40 to 125°C temp range. Ideal for automotive applications with SPI bus compatibility and low power mode for efficient serial communication control.

Median Price

$2.070

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 3,435 parts In-Stock

1+ parts

$2.070

100+ parts

$1.560

1k+ parts

$1.450

10k+ parts

$1.370

3,435

$2.070

$1.560

$1.450

$1.370

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.370

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50

$1.370

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Vyrian

USA . 167,781 parts In-Stock

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167,781

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,382 parts In-Stock

1+ parts

$1.370

100+ parts

-

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$1.343

6,382

$1.370

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$1.343

Argo Parts USA

USA . 2,208 parts In-Stock

1+ parts

$1.370

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2,208

$1.370

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.370

100+ parts

-

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$1.302

10k+ parts

$1.274

50

$1.370

-

$1.302

$1.274

Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

$1.521

100+ parts

$1.505

1k+ parts

$1.460

10k+ parts

-

750

$1.521

$1.505

$1.460

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Semicontronic

India . 161,573 parts In-Stock

1+ parts

$1.760

100+ parts

$1.716

1k+ parts

$1.707

10k+ parts

-

161,573

$1.760

$1.716

$1.707

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Ampacity Inc.

Singapore . 161,681 parts In-Stock

1+ parts

$3.830

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161,681

$3.830

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AZTECH Wire

Italy . 1,080 parts In-Stock

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$9.370

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$9.370

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Aztec Data Supply Inc.

USA . 1,943 parts In-Stock

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$55.520

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1,943

$55.520

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Advanced Electronics

New Zealand . 59 parts In-Stock

1+ parts

$59.803

100+ parts

$56.813

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$56.813

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59

$59.803

$56.813

$56.813

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Corohmni

South Africa . 206 parts In-Stock

1+ parts

$83.617

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Lixinc

USA . 16,013 parts In-Stock

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RC Electronics

USA . 12,000 parts In-Stock

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Futuretech Components

Singapore . 6,000 parts In-Stock

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West Coast Incorporated

USA . 5,722 parts In-Stock

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Microchip USA

USA . 1,214 parts In-Stock

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Robosynatics

Brazil . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Lucentia Tech

USA . 1,000 parts In-Stock

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$9.634

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$9.634

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$9.634

1,000

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$9.634

$9.634

$9.634

Overview

Elevate your automotive communication systems with the MCP2518FDT-E/QBBVAO by Microchip Technology. This high-quality Serial Communication Controller offers a seamless sync, bit, and byte communication protocol, enabling data transfer rates of up to 1 MBps at a maximum clock frequency of 40 MHz. With a wide operating temperature range of -40°C to 125°C, this product is designed for rugged automotive environments. Experience reliable performance and streamlined connectivity with the MCP2518FDT-E/QBBVAO, setting new standards in communication controllers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and ensuring reliability.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing its versatility.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy integration into existing designs.

No. of Terminals: 14

A sufficient number of terminals allows for multiple connections and functionality, increasing the versatility of the product.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

Maximum Data Transfer Rate: 1 MBps

High data transfer rate enables fast and efficient communication, making it ideal for applications requiring quick data exchange.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold conditions without compromising performance.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and connection options.

Width: 3 mm

Compact width enables easy integration into tight spaces and smaller devices.

Communication Protocol: SYNC; BIT ;BYTE

Support for multiple communication protocols ensures compatibility with various systems and devices.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast data processing and communication, improving overall system performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in automotive applications where temperature fluctuations are common.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed for serial communication control, making it suitable for applications that require serial data transmission.

Technology: CMOS

CMOS technology offers low power consumption and compatibility with a wide range of devices.

Maximum Supply Current: 20 mA

Low maximum supply current reduces power consumption and heat generation, making it energy-efficient.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Bus Compatibility: SPI

SPI bus compatibility allows for easy integration and communication with other SPI-compliant devices.

Low Power Mode: YES

Low power mode option helps in conserving energy and extending battery life in portable or low-power applications.

Technical Specifications

Serial Communication Controllers MCP2518FDT-E/QBBVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Maximum Data Transfer Rate:

1 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e3

Length:

4.5 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.18X.12,30

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.9 mm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MCP2518FDT-E/QBBVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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