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SCC2692AC1A44,512

NXP Semiconductors

SCC2692AC1A44,512 by NXP Semiconductors

SCC2692AC1A44,512 by NXP Semiconductors is a Serial Communication Controller with 5V power supply, 3.6864 MHz clock frequency, and 0.125 MBps data transfer rate. It is used for asynchronous communication protocols in commercial-grade applications requiring low power consumption and 15 I/O lines.

Median Price

$4.308

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

USA . 4,318 parts In-Stock

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Flip Electronics

USA . 2,600 parts In-Stock

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Anansix

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Vyrian

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North Shore Components

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Avant Electronics Limited

UK . 77 parts In-Stock

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Greenchips

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Zilex Electronics Inc.

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Distributors (Availability)

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One Stop Electronics

USA . 1,117 parts In-Stock

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$4.000

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Aranea Global

USA . 100 parts In-Stock

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$4.222

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$4.053

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Continental Prestige Electronics

USA . 5,579 parts In-Stock

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Argo Parts USA

USA . 1,095 parts In-Stock

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Ampacity Inc.

Singapore . 1,600 parts In-Stock

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AZTECH Wire

Italy . 533 parts In-Stock

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Microchip USA

USA . 431 parts In-Stock

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Corphita

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UNI Independent Distributors

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Perfect Parts

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Overview

Enhance your communication systems with the SCC2692AC1A44,512 by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-quality products that guarantee reliability and performance. This Serial Communication Controller offers seamless data transfer, optimal power efficiency, and versatile applications across various industries. Experience the value of enhanced connectivity and streamlined operations with this innovative solution. Upgrade your technology with NXP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into electronic devices.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5 V ensures compatibility with various power sources.

Address Bus Width: 4

A wider address bus width of 4 allows for more efficient communication and data transfer.

Power Supplies (V): 5

The standard power supply voltage of 5 V ensures compatibility with many electronic systems.

No. of Terminals: 44

Having 44 terminals provides ample connectivity options for a variety of external devices.

Package Style (Meter): CHIP CARRIER

Chip carrier package style allows for compact design and easy installation onto circuit boards.

Minimum Supply Voltage: 4.5 V

Support for a minimum supply voltage of 4.5 V ensures stable operation even with lower power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliability in various environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

The high maximum data transfer rate of 0.125 MBps allows for fast and efficient communication.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures the product can function in colder environments.

Terminal Position: QUAD

Quad terminal position enables easy connection to external devices and peripherals.

Maximum Seated Height: 4.57 mm

Low maximum seated height of 4.57 mm allows for compact and slim device designs.

Data Encoding or Decoding Method: NRZ

NRZ data encoding or decoding method ensures reliable and accurate transmission of data.

External Data Bus Width: 8

Having an external data bus width of 8 facilitates high-speed data transfer and communication.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocols offers flexibility in data transmission.

Maximum Clock Frequency: 3.6864 MHz

High maximum clock frequency of 3.6864 MHz allows for rapid data processing and communication.

Peak Reflow Temperature °C: 245

High peak reflow temperature of 245°C ensures robust soldering during assembly.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Low Power Mode: YES

Low power mode capability helps in reducing power consumption and extending device battery life.

Technical Specifications

Serial Communication Controllers SCC2692AC1A44,512 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

3.6864 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.5862 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.5862 mm

Trade Compliance

SCC2692AC1A44,512 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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