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MCP25625T-E/ML

Microchip Technology

MCP25625T-E/ML by Microchip Technology

MCP25625T-E/ML by Microchip: Serial Communication Controller for CAN protocol. Operates at 2.7-5.5V, with data rate of 0.125 MBps and clock frequency up to 25 MHz. Ideal for automotive applications due to TS 16949 screening, -40 to 125 °C temp range, and low power mode support.

Median Price

$3.314

Lifecycle Status

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22

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1k+

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Chip1Stop

Japan . 4,800 parts In-Stock

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$2.990

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$2.130

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$2.990

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Arrow

USA . 2,499 parts In-Stock

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$3.247

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$3.097

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$2.947

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$3.247

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Microchip Technology

USA . 81,080 parts In-Stock

1+ parts

$3.380

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$2.570

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$2.370

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$2.240

81,080

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$2.570

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$2.240

DigiKey

USA . 5,561 parts In-Stock

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$3.380

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$2.570

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Mouser Electronics

USA . 5,023 parts In-Stock

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Newark

USA . 4,122 parts In-Stock

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$2.780

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Farnell

UK . 7,146 parts In-Stock

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$2.661

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$2.635

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Elektronika Sales Private Limited

India . 16,000 parts In-Stock

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Element14

Singapore . 7,146 parts In-Stock

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Verical

USA . 2,499 parts In-Stock

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$3.097

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Master Electronics

USA . 1,215 parts In-Stock

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$2.532

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$2.495

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$2.445

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Mobius Materials

USA . 70,808 parts In-Stock

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$2.170

100+ parts

$1.740

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Nova Conductors

Japan . 650 parts In-Stock

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$2.835

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Maritex

Poland . 13,200 parts In-Stock

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$2.890

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$2.197

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$2.197

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$2.197

NAC Semi

USA . 99,200 parts In-Stock

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$3.180

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$2.880

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$2.630

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Cyclops Electronics Ltd

UK . 69,470 parts In-Stock

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Vyrian

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Chip Stock

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IBS Electronics

USA . 2,815 parts In-Stock

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$3.551

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$3.499

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$3.429

Sensible Micro Corp

USA . 490 parts In-Stock

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ComSIT Distribution GmbH

Germany . 47 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 30 parts In-Stock

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Semicontronic

India . 51,772 parts In-Stock

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$2.140

100+ parts

$2.086

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$2.076

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$2.140

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$2.076

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Modulus Dynamics

Lithuania . 2,000 parts In-Stock

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$2.562

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$2.562

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$2.562

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Corohmni

South Africa . 852 parts In-Stock

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$2.639

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$2.639

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Continental Prestige Electronics

USA . 7,450 parts In-Stock

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$2.080

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Argo Parts USA

USA . 4,193 parts In-Stock

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Ampacity Inc.

Singapore . 43,308 parts In-Stock

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Aztec Data Supply Inc.

USA . 518 parts In-Stock

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Eastek

USA . 124,800 parts In-Stock

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GreenTree Electronics

Israel . 94,400 parts In-Stock

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Infinite Electronics LLP (Excess)

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RC Electronics

USA . 5,852 parts In-Stock

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Lucentia Tech

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 4,200 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 1,600 parts In-Stock

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Perfect Parts

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Assy Fe

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iodParts Technologies Inc.

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Netroflash

USA . 500 parts In-Stock

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Fulton Briggs Corp.

USA . 300 parts In-Stock

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Overview

Unlock seamless communication capabilities with the MCP25625T-E/ML from Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability in their products. The MCP25625T-E/ML falls under the category of Serial Communication Controllers, making it an essential component for various applications. With its low power mode and maximum data transfer rate of 0.125 MBps, this product offers unmatched value and benefits. Experience the advantages of CAN communication protocol, SPI bus compatibility, and high-speed performance, all in a compact and versatile package. Elevate your projects with the MCP25625T-E/ML today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy and compact installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power source options.

Screening Level: TS 16949

Complies with automotive industry quality standards, ensuring reliability in harsh environments.

Minimum Supply Voltage: 2.7 V

Works effectively with lower supply voltages, saving energy and extending battery life.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature conditions without performance degradation.

Maximum Data Transfer Rate: 0.125 MBps

Enables fast and efficient data communication, ideal for time-sensitive applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, suitable for a wide range of climates.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package design provides efficient heat dissipation and compact size for space-constrained applications.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant connection for improved signal integrity.

Communication Protocol: CAN

Supports the widely used CAN protocol for secure and efficient communication in automotive and industrial applications.

Maximum Clock Frequency: 25 MHz

High clock frequency allows for fast data processing and high-speed communication.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency.

Maximum Supply Current: 10 mA

Low supply current requirement reduces power consumption and extends battery life.

Nominal Supply Voltage: 4.5 V

Operates efficiently at the typical supply voltage, ensuring stable performance.

Bus Compatibility: SPI

Supports SPI bus interface for easy integration with a wide range of devices and peripherals.

Low Power Mode: YES

Includes a low power mode feature for energy-efficient operation and extended battery life.

Technical Specifications

Serial Communication Controllers MCP25625T-E/ML attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

CAN

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N28

JESD-609 Code:

e3

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

6 mm

Trade Compliance

MCP25625T-E/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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