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LAN9253T-V/R4X

Microchip Technology

LAN9253T-V/R4X by Microchip Technology

LAN9253T-V/R4X by Microchip Technology is a Serial Communication Controller with 16-bit Address Bus, 12.5 MBps Data Transfer Rate, and 25 MHz Clock Frequency. It is ideal for applications requiring high-speed data communication over I2C or SPI buses in industrial automation and networking systems.

Median Price

$19.163

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$19.163

100+ parts

-

1k+ parts

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10k+ parts

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500

$19.163

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Vyrian

USA . 3,144 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,144

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,632 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

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10k+ parts

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1,632

$6.000

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AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$10.855

100+ parts

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1k+ parts

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599

$10.855

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Semicontronic

India . 1,229 parts In-Stock

1+ parts

$15.000

100+ parts

$14.625

1k+ parts

$14.550

10k+ parts

-

1,229

$15.000

$14.625

$14.550

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Continental Prestige Electronics

USA . 5,213 parts In-Stock

1+ parts

$19.163

100+ parts

-

1k+ parts

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10k+ parts

$18.780

5,213

$19.163

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-

$18.780

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$19.163

100+ parts

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1k+ parts

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2,000

$19.163

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Aztec Data Supply Inc.

USA . 4,207 parts In-Stock

1+ parts

$25.830

100+ parts

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4,207

$25.830

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Corohmni

South Africa . 1,041 parts In-Stock

1+ parts

$51.689

100+ parts

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1,041

$51.689

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West Coast Incorporated

USA . 7,398 parts In-Stock

1+ parts

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7,398

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Argo Parts USA

USA . 2,106 parts In-Stock

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2,106

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Overview

Enhance your serial communication capabilities with the LAN9253T-V/R4X by Microchip Technology. Crafted with precision and quality, this Serial Communication Controller offers seamless data transfer at a blazing 12.5 MBps rate. From SYNC to BYTE communication protocols, this versatile chip is perfect for a wide range of applications. With low power mode and boundary scan support, enjoy reliable performance and efficiency. Elevate your projects with the LAN9253T-V/R4X and experience the difference in connectivity and speed.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product a convenient choice for manufacturing processes.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures safe operation and reliable performance, making it a secure option for various applications.

Address Bus Width: 16

With a wide address bus width of 16, this product can efficiently handle large amounts of data, making it suitable for tasks requiring extensive memory access.

Package Shape: SQUARE

The square package shape offers a compact design, making this product ideal for space-constrained applications where size matters.

No. of Terminals: 64

The ample number of terminals (64) provides flexibility in connecting to other components, enhancing the product's versatility in different system configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving benefits, making it a practical choice for thermal management and compact designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V allows for energy-efficient operation, making this product a cost-effective option for power-conscious applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand harsh environmental conditions, making it reliable in extreme temperature settings.

Maximum Data Transfer Rate: 12.5 MBps

The high maximum data transfer rate of 12.5 MBps enables fast and efficient communication, making this product suitable for data-intensive tasks that require quick processing.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in cold environments, making this product a dependable choice for a wide range of applications.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity and installation, providing convenience and flexibility in system integration.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this product offers a low-profile design, making it suitable for compact electronic devices with height restrictions.

Width: 9 mm

The width of 9 mm provides a slim form factor, allowing for space-efficient PCB layout and integration, making this product ideal for applications with limited space.

Boundary Scan: YES

The boundary scan feature enables efficient testing and troubleshooting during production and maintenance, enhancing the product's reliability and ease of use.

Data Encoding or Decoding Method: NRZI

The NRZI data encoding or decoding method ensures reliable data transmission, making this product a suitable choice for communication applications that require data integrity.

External Data Bus Width: 16

A wide external data bus width of 16 enhances data throughput and processing speed, making this product ideal for applications that demand high data bandwidth.

Communication Protocol: SYNC, BYTE

Supporting synchronous and byte communication protocols, this product offers compatibility with various systems, making it versatile and easily integratable.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency of 25 MHz, this product can handle fast data processing, making it suitable for applications requiring high-speed operation.

Length: 9 mm

The length of 9 mm provides a compact footprint, contributing to space-saving designs and efficient PCB layouts, making this product suitable for miniaturized devices.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

As a serial I/O and communication controller with LAN connectivity, this product offers a wide range of interfacing options, making it versatile and adaptable to different networking requirements.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noise-prone environments.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and reduces the risk of soldering defects, enhancing the product's reliability and manufacturability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V offers stable and efficient power operation, making this product a suitable choice for applications requiring consistent voltage levels.

No. of Serial I/Os: 4

With four serial I/O ports, this product provides multiple communication channels, allowing for versatile connectivity and data exchange in complex systems.

Bus Compatibility: I2C; SPI

Supporting I2C and SPI bus compatibility, this product offers flexibility in interfacing with different devices, enhancing its adaptability and ease of integration.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm enables dense packing and efficient board space utilization, making this product suitable for high-density PCB designs.

Low Power Mode: YES

The low power mode functionality enhances energy efficiency and extends battery life, making this product a practical choice for portable and power-sensitive applications.

Technical Specifications

Serial Communication Controllers LAN9253T-V/R4X attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

I2C; SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE

Data Encoding or Decoding Method:

NRZI

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

LAN9253T-V/R4X Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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