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SC16IS750IBS/S900

NXP Semiconductors

SC16IS750IBS/S900 by NXP Semiconductors

SC16IS750IBS/S900 by NXP Semiconductors is a Serial Communication Controller with 24 terminals, operating at 3.3V nominal voltage and supporting data rates up to 0.625 MBps. It features low power mode, operates in industrial temperature range (-40 to 85 °C), and communicates using ASYNC and BIT protocols. Ideal for applications requiring high-speed serial communication in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,834 parts In-Stock

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2,834

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Anansix

USA . 2,733 parts In-Stock

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2,733

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Vyrian

USA . 291 parts In-Stock

1+ parts

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291

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$12.492

100+ parts

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1k+ parts

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291

$12.492

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One Stop Electronics

USA . 1,288 parts In-Stock

1+ parts

$22.000

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1,288

$22.000

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Continental Prestige Electronics

USA . 5,436 parts In-Stock

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5,436

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Argo Parts USA

USA . 3,952 parts In-Stock

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3,952

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Corphita

USA . 2,342 parts In-Stock

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2,342

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UNI Independent Distributors

Spain . 2,255 parts In-Stock

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2,255

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock seamless communication possibilities with the SC16IS750IBS/S900 by NXP Semiconductors. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled quality and reliability for a wide range of applications. Experience enhanced connectivity and efficiency with its advanced technology, low power mode, and high-speed data transfer rate. Elevate your projects with the trusted performance and value that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy and compact PCB assembly.

Maximum Supply Voltage:

3.6 V - High voltage tolerance for versatile applications.

Address Bus Width:

2 - Sufficient bus width for efficient data transfer.

Package Shape:

SQUARE - Compact design for space-saving installations.

No. of Terminals:

24 - Plenty of terminals for connectivity options.

Package Style:

CHIP CARRIER, HEAT SINK/SLUG - Ensures efficient heat dissipation for optimal performance.

Minimum Supply Voltage:

3 V - Low power consumption for energy efficiency.

Maximum Operating Temperature:

85 °C - Suitable for industrial environments with varying temperatures.

Maximum Data Transfer Rate:

0.625 MBps - High transfer rate for quick data exchange.

Minimum Operating Temperature:

40 °C - Operates reliably even in extreme cold conditions.

Terminal Position:

QUAD - Convenient terminal layout for easy connections.

Maximum Seated Height:

1 mm - Low profile design for compact devices.

Width:

4 mm - Slim width for fitting in tight spaces.

Data Encoding or Decoding Method:

NRZ - Efficient data encoding method for accurate transmission.

Communication Protocol:

ASYNC, BIT - Compatible with various communication protocols for flexibility.

Maximum Clock Frequency:

80 MHz - High clock frequency for fast data processing.

Length:

4 mm - Compact length for space-constrained applications.

Temperature Grade:

INDUSTRIAL - Designed to withstand harsh industrial environments.

Peripheral IC Type:

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL - Ideal for serial communication applications.

Technology:

CMOS - Reliable and efficient CMOS technology for high performance.

Terminal Form:

NO LEAD - Lead-free terminals for environmental friendliness.

Nominal Supply Voltage:

3.3 V - Stable supply voltage for consistent performance.

Terminal Pitch:

0.5 mm - Narrow terminal pitch for compact PCB designs.

Low Power Mode:

YES - Energy-saving feature for prolonged battery life.

Technical Specifications

Serial Communication Controllers SC16IS750IBS/S900 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

CAN ALSO OPERATES AT 2.5 V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

SC16IS750IBS/S900 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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