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FT4232HAQ-REEL

FTDI

FT4232HAQ-REEL by FTDI

FTDI's FT4232HAQ-REEL is a Serial Communication Controller with 4 serial I/Os, supporting various protocols like I2C, RS-232, SPI. It operates b/w -40 to 105°C and offers a data transfer rate of 60 MBps. Ideal for low power applications due to its min supply voltage of 1.08 V.

Median Price

$12.036

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Nova Conductors

Japan . 29 parts In-Stock

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$14.150

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29

$14.150

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IBS Electronics

USA . 7,800 parts In-Stock

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$9.923

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$9.923

Vyrian

USA . 3,696 parts In-Stock

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3,696

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 477 parts In-Stock

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$10.663

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477

$10.663

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Aranea Global

USA . 100 parts In-Stock

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$13.867

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$13.312

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100

$13.867

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$13.312

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Continental Prestige Electronics

USA . 5,875 parts In-Stock

1+ parts

$14.150

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$13.867

5,875

$14.150

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$13.867

Aztec Data Supply Inc.

USA . 2,829 parts In-Stock

1+ parts

$14.570

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2,829

$14.570

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Corohmni

South Africa . 26 parts In-Stock

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$46.564

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26

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Argo Parts USA

USA . 1,170 parts In-Stock

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Overview

Experience seamless and reliable data communication with the FT4232HAQ-REEL from FTDI. As a leading manufacturer in the industry, FTDI provides cutting-edge solutions for serial communication controllers. This versatile product is perfect for various applications, offering high-speed data transfer rates of up to 60 MBps and low power mode for energy efficiency. With a wide range of bus compatibility and advanced technology, the FT4232HAQ-REEL ensures top-notch performance and value for customers looking for quality and reliability in their communication needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and enabling streamlined manufacturing processes.

Maximum Supply Voltage: 1.32 V

Operates efficiently at a low voltage, reducing power consumption and prolonging battery life.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making it suitable for automotive applications where robustness is essential.

Package Shape: SQUARE

Provides a compact form factor, optimizing board space and enabling efficient integration into various electronic systems.

No. of Terminals: 64

Offers a sufficient number of connection points for versatile connectivity options and enhanced functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Utilizes advanced packaging technology to enhance thermal performance, improve reliability, and enable high-density mounting.

Minimum Supply Voltage: 1.08 V

Supports operation at a low voltage level, ensuring flexibility in power supply requirements and efficient energy usage.

Maximum Operating Temperature: 105 °C

Can operate reliably under high temperature conditions, suitable for demanding industrial environments.

Maximum Data Transfer Rate: 60 MBps

Enables fast and efficient communication for high-speed data transfer applications, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for outdoor or harsh environment applications.

Terminal Position: QUAD

Facilitates easy connection and integration into quad configuration setups, simplifying system design and installation.

Maximum Seated Height: 0.8 mm

Offers a low profile design for space-constrained applications, enabling compact and sleek product designs.

Width: 9 mm

Compact width dimensions allow for versatile placement on circuit boards and efficient use of available space.

Boundary Scan: YES

Allows for easy testing and debugging of the device during production, ensuring high quality and reliability of the end product.

Communication Protocol: ASYNC, BIT; SYNC, BYTE

Supports multiple communication protocols for flexible and interoperable data exchange in various systems and devices.

Maximum Clock Frequency: 12 MHz

Enables quick data processing and synchronization, suitable for applications requiring high-speed data transfer and real-time communication.

Maximum Time At Peak Reflow Temperature (s): 40

Ensures reliable soldering and thermal stability during manufacturing processes, reducing the risk of component damage or failure.

Peak Reflow Temperature °C: 260

Meets industry-standard reflow temperature requirements, ensuring proper soldering and component durability during production.

Length: 9 mm

Compact length dimensions allow for efficient use of board space, enabling flexible placement in various electronic systems.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Provides versatile communication capabilities and functionality for serial data transmission, suitable for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high speed, and compatibility with a wide range of digital systems and devices.

Terminal Form: NO LEAD

Facilitates surface mount soldering and improves manufacturing efficiency, ensuring reliable connections and long-term performance.

Nominal Supply Voltage: 1.2 V

Standard voltage level for consistent and reliable operation, suitable for a wide range of electronic devices and systems.

No. of Serial I/Os: 4

Provides multiple serial I/O ports for versatile connectivity options and efficient data exchange in multi-device communication setups.

Bus Compatibility: I2C; RS-232; RS-422; RS-485; SPI; UART; USB

Supports a wide range of bus protocols for seamless integration into various systems, enabling flexible and interoperable data communication.

Terminal Pitch: 0.5 mm

Compact terminal pitch for high-density mounting, allowing for efficient use of board space and enabling compact product designs.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during manufacturing and operation, ensuring long-term reliability and performance.

Low Power Mode: YES

Features a low power mode for energy-efficient operation and extended battery life, ideal for portable and battery-powered applications.

No. of I/O Lines: 8

Provides multiple I/O lines for versatile connectivity options and enhanced flexibility in system configuration and data exchange.

Technical Specifications

Serial Communication Controllers FT4232HAQ-REEL attributes and parameters. Explore more Serial Communication Controllers devices from FTDI

Specs

Boundary Scan:

YES

Bus Compatibility:

I2C; RS-232; RS-422; RS-485; SPI; UART; USB

Maximum Clock Frequency:

12 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE

Maximum Data Transfer Rate:

60 MBps

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

8

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

FT4232HAQ-REEL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

FTDI

FTDI Chip is a fab-less semiconductor company established in 1992, partnered with the world’s leading foundries. The headquarter is located in Glasgow, UK and is supported with research and development facilities in Glasgow, Singapore and Taipei (Taiwan) plus regional sales and technical support sites in Glasgow, Taipei, Tigard (Oregon, USA) and Shanghai (China). FTDI Chip develops innovative silicon solutions that enhance interaction with the latest in global technology. The major objective from the company is to ‘bridge technologies’ in order to support engineers with highly sophisticated, feature-rich, robust and simple-to-use product platforms. FTDI Chip continues its philosophy of Design Made Easy, where it strives to incorporate device and system features in its chips that enable the designer to quickly and easily create and implement designs. We supplement this strategy, with WW regional support and a “total” solutions mindset to provide reduced development and debug costs and a fast time to market.

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