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SC28L194A1BE,557

NXP Semiconductors

SC28L194A1BE,557 by NXP Semiconductors

SC28L194A1BE,557 by NXP Semiconductors is a Serial Communication Controller with 80 terminals and operates at a max clock frequency of 33 MHz. It supports data encoding using NRZ method and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring low power mode and external data bus width of 8 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,469 parts In-Stock

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4,469

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Vyrian

USA . 3,447 parts In-Stock

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Anansix

USA . 208 parts In-Stock

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208

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Distributors (Availability)

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Semicontronic

India . 1,469 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

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1,469

$3.000

$2.925

$2.910

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AZTECH Wire

Italy . 480 parts In-Stock

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$10.835

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480

$10.835

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Ampacity Inc.

Singapore . 767 parts In-Stock

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$18.000

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767

$18.000

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Aztec Data Supply Inc.

USA . 1,306 parts In-Stock

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$18.500

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$18.500

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One Stop Electronics

USA . 1,200 parts In-Stock

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$32.000

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$32.000

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Microchip USA

USA . 203 parts In-Stock

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$55.775

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203

$55.775

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Corohmni

South Africa . 329 parts In-Stock

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$75.274

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329

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Continental Prestige Electronics

USA . 3,459 parts In-Stock

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UNI Independent Distributors

Spain . 3,373 parts In-Stock

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Bastille Electronics

Australia . 2,969 parts In-Stock

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Argo Parts USA

USA . 1,602 parts In-Stock

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Corphita

USA . 1,182 parts In-Stock

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Advanced Electronics

New Zealand . 870 parts In-Stock

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870

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Overview

Unlock seamless communication capabilities with the SC28L194A1BE,557 from NXP Semiconductors. Crafted with precision and reliability in mind, this Serial Communication Controller offers unparalleled performance for a wide range of applications. Elevate your projects with ease, knowing that you're getting a top-quality product that guarantees efficiency and convenience. Say goodbye to communication bottlenecks and hello to streamlined operations with the SC28L194A1BE,557. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and helps protect the internal components of the product.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of electronic systems.

Address Bus Width: 7

The 7-bit address bus width allows for efficient communication and data transfer between components.

Package Shape: SQUARE

The square package shape provides a standardized form factor for easy integration into various systems.

Power Supplies (V): 3.3/5

Support for both 3.3V and 5V power supplies increases versatility and compatibility with different devices.

No. of Terminals: 80

The abundance of terminals enables multiple connections and functions, enhancing the overall performance of the product.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances reliability and ease of assembly in various electronic applications.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures efficient operation and power management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial environments with fluctuating temperature conditions.

Maximum Data Transfer Rate: 0.125 MBps

The high data transfer rate enables fast and reliable communication between devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold environments.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and ensures long-term reliability.

Terminal Position: QUAD

The quad terminal position layout allows for efficient connection and communication with other components.

Maximum Seated Height: 1.6 mm

The low seated height enables compact and space-saving designs without compromising performance.

Width: 12 mm

The 12mm width provides a compact form factor suitable for various electronic applications.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding or decoding method ensures accurate and efficient data transmission.

External Data Bus Width: 8

The 8-bit external data bus width allows for the simultaneous transfer of larger data packets, enhancing speed and efficiency.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication and bit-level protocols enables flexibility and compatibility with different systems.

Maximum Clock Frequency: 33 MHz

The high clock frequency ensures fast data processing and communication speed.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable and durable solder joints.

Length: 12 mm

The 12mm length complements the compact width and height for a well-balanced form factor.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions commonly found in industrial settings.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The serial IO and communication controller type offers versatile connectivity and communication capabilities for various applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy installation and reliable connections on circuit boards.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility and stability with standard power sources.

No. of Serial I/Os: 4

The 4 serial IO ports offer multiple connectivity options for various external devices and peripherals.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for high-density mounting on PCBs, ideal for space-constrained designs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates moderate sensitivity to moisture, suitable for typical storage and handling conditions.

Low Power Mode: YES

The low power mode feature helps conserve energy and prolong battery life, ideal for portable or battery-operated devices.

Technical Specifications

Serial Communication Controllers SC28L194A1BE,557 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 20 MHZ

Address Bus Width:

7

Boundary Scan:

NO

Maximum Clock Frequency:

33 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC28L194A1BE,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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