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LAN7431T-V/YXXVAO

Microchip Technology

LAN7431T-V/YXXVAO by Microchip Technology

LAN7431T-V/YXXVAO by Microchip Technology is a Serial Communication Controller with 256 MBps data transfer rate, supporting SYNC, BYTE, and ETHERNET protocols. It operates in industrial temperature range (-40 to 105 °C) with low power mode. Ideal for PCI bus compatibility applications requiring high-speed communication in compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,732 parts In-Stock

1+ parts

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5,732

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,544 parts In-Stock

1+ parts

$7.870

100+ parts

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2,544

$7.870

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AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$9.178

100+ parts

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563

$9.178

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Corohmni

South Africa . 346 parts In-Stock

1+ parts

$42.856

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346

$42.856

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Aztec Data Supply Inc.

USA . 4,965 parts In-Stock

1+ parts

$49.470

100+ parts

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4,965

$49.470

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QualityLine Systems

Poland . 7,158 parts In-Stock

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7,158

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XL Components Corporation

Australia . 4,938 parts In-Stock

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4,938

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Marpe Global Electronics

Taiwan . 3,947 parts In-Stock

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3,947

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Continental Prestige Electronics

USA . 3,785 parts In-Stock

1+ parts

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3,785

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Argo Parts USA

USA . 528 parts In-Stock

1+ parts

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528

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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100+ parts

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50

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Overview

Elevate your serial communication capabilities with the LAN7431T-V/YXXVAO by Microchip Technology. As a leading manufacturer in the industry, Microchip delivers top-quality products designed for a wide range of applications. With a focus on reliability and performance, this Serial Communication Controller offers customers unparalleled value and benefits. Experience seamless data transfer rates of up to 256 MBps, low power mode functionality, and industrial-grade temperature tolerance. Trust Microchip Technology to provide innovative solutions for all your communication needs. Elevate your technology with the LAN7431T-V/YXXVAO today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto PCBs, saving space and making for efficient assembly.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage allows for flexibility in powering the device without risking damage, ensuring reliability in various operating conditions.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive industry standards ensures high quality and reliability, making this product suitable for automotive applications.

Package Shape: SQUARE

Square package shape provides better handling and placement during assembly, ensuring accurate alignment on the PCB.

No. of Terminals: 72

Having a high number of terminals allows for versatile connectivity options and interfaces, increasing the product's functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers thermal management advantages, compact size, and compatibility with modern design requirements for electronic devices.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage enables energy-efficient operation and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments and industrial applications.

Maximum Data Transfer Rate: 256 MBps

High data transfer rate allows for speedy communication between devices, improving overall system efficiency and performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can function in extreme cold environments without performance degradation.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability, ensuring secure and reliable connections during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing of signals and connections, optimizing PCB layout and reducing signal interference.

Maximum Seated Height: 1 mm

Low seated height contributes to a compact form factor, ideal for space-constrained designs and applications.

Width: 10 mm

Narrow width facilitates easy placement and integration into small electronic devices, saving space on the PCB.

Boundary Scan: YES

Boundary scan support enables efficient testing and debugging of the product during manufacturing and maintenance, leading to higher production yields and lower costs.

Communication Protocol: SYNC, BYTE; ETHERNET

Support for multiple communication protocols enhances compatibility with various devices and networks, enabling seamless data exchange and interoperability.

Maximum Clock Frequency: 25 MHz

High clock frequency capability allows for fast data processing and communication speeds, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow soldering process with a short time at peak temperature ensures proper soldering without damaging the components.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the product can withstand the soldering process without degradation, ensuring reliability.

Length: 10 mm

Compact length makes the product suitable for small form factor designs, maximizing space utilization in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliable operation in demanding industrial environments, making this product suitable for rugged applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Peripheral IC type specifically designed for serial communication tasks enhances the product's performance and compatibility in various applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with various digital systems, making this product energy-efficient and versatile.

Terminal Form: NO LEAD

No-lead terminal form construction complies with environmental standards, reduces manufacturing costs, and enhances reliability in harsh environments.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and power efficiency, meeting the requirements of modern electronic devices.

No. of Serial I/Os: 4

Multiple serial I/O options provide flexibility in connecting to different devices, expanding the product's compatibility and functionality.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration with existing systems and devices, simplifying the design and connectivity process.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connections, enabling compact designs and efficient use of space on the PCB.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate moisture sensitivity, requiring standard handling precautions during storage and assembly to maintain product integrity.

Low Power Mode: YES

Low power mode functionality offers energy-saving capabilities for extended battery life in portable devices and reduces overall power consumption in various applications.

Technical Specifications

Serial Communication Controllers LAN7431T-V/YXXVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

ALSO HAVING NETWORK PROTOCOLS IEEE 802.3AZ; IEEE 802.1Q; IEEE 802.3X

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

256 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N72

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

4

No. of Terminals:

72

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

LAN7431T-V/YXXVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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