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MCP2510-I/P

Microchip Technology

MCP2510-I/P by Microchip Technology

MCP2510-I/P by Microchip Tech: 5.5V max supply, 0.125 MBps data rate, -40 to 85 °C temp range. Serial IO/Comm Controller for SPI bus applications in industrial settings.

Median Price

$4.360

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

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Microchip Technology

USA . 575 parts In-Stock

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$3.310

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$3.190

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$3.170

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Mouser Electronics

USA . 498 parts In-Stock

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DigiKey

USA . 145 parts In-Stock

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$4.360

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$3.513

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Farnell

UK . 141 parts In-Stock

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$4.441

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$3.707

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Newark

USA . 29 parts In-Stock

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$4.490

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$3.620

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Element14

Singapore . 100 parts In-Stock

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Arrow

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Component Electronics Inc.

Canada . 1 parts In-Stock

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$3.850

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$2.880

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$2.500

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$3.850

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Nova Conductors

Japan . 18 parts In-Stock

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$3.985

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NAC Semi

USA . 1,250 parts In-Stock

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$4.130

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$3.750

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$3.430

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Cyclops Electronics Ltd

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Goldney Electronics S.L.

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Vyrian

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Fibra_Brandt Electronic GMBH

Germany . 63 parts In-Stock

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PC Components Company LLC

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Schukat

Germany . 40 parts In-Stock

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Bristol Electronics

USA . 31 parts In-Stock

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LIBRA Elektronik GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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Ampacity Inc.

Singapore . 377 parts In-Stock

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$2.940

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Semicontronic

India . 314 parts In-Stock

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$2.940

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$2.866

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$2.852

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Continental Prestige Electronics

USA . 303 parts In-Stock

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Argo Parts USA

USA . 1,308 parts In-Stock

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Aranea Global

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$40.402

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$39.998

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Aztec Data Supply Inc.

USA . 1,287 parts In-Stock

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Corohmni

South Africa . 635 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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GreenTree Electronics

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Perfect Parts

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West Coast Incorporated

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Eastek

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Overview

Enhance your communication systems with the MCP2510-I/P from Microchip Technology. As a leader in the industry, Microchip Technology delivers top-notch quality and reliability in their products, ensuring seamless operations. The MCP2510-I/P, a Serial Communication Controller, offers unmatched performance, flexibility, and efficiency. With a wide range of applications, this product provides exceptional value to customers seeking high-speed data transfer, low power consumption, and industrial-grade temperature tolerance. Upgrade your systems today with the MCP2510-I/P and experience the superior advantages it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the product, ensuring a longer lifespan.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options, accommodating a wide range of voltage inputs.

On Chip Data RAM Width: 8

Provides sufficient memory for storing and processing data efficiently.

Screening Level: TS 16949

Ensures high-quality manufacturing standards and reliability of the product.

Maximum Data Transfer Rate: 0.125 MBps

Enables fast and efficient data transfer, enhancing overall performance.

Communication Protocol: SYNC; BIT ;BYTE

Supports multiple communication protocols, increasing compatibility with various systems.

Temperature Grade: INDUSTRIAL

Designed to operate in industrial environments with varying temperature conditions, making it versatile and reliable.

Low Power Mode: YES

Helps to conserve energy and extend battery life, ideal for portable or low-power applications.

Technical Specifications

Serial Communication Controllers MCP2510-I/P attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Additional Features:

OPERATES AT 3V MINIMUM SUPPLY @ 16 MHZ

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.86 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

18

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

RAM Words:

14

Screening Level:

TS 16949

Maximum Seated Height:

4.32 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MCP2510-I/P Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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