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SC16IS752IBS,157

NXP Semiconductors

SC16IS752IBS,157 by NXP Semiconductors

SC16IS752IBS,157 by NXP Semiconductors is a Serial Communication Controller with 2 address bus width and 32 terminals. It operates at a max supply voltage of 3.6V and supports communication protocols like ASYNC and BIT. Ideal for industrial applications requiring low power consumption and high data transfer rates up to 0.625 MBps.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

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1k+

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Verical

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Digiode

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Anansix

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Semi Source

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Inventory MP

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Bristol Electronics

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Nova Conductors

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Semicontronic

India . 7 parts In-Stock

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$4.875

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AZTECH Wire

Italy . 238 parts In-Stock

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Ampacity Inc.

Singapore . 7 parts In-Stock

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Corohmni

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Overview

Upgrade your communication systems with the SC16IS752IBS,157 by NXP Semiconductors. This Serial Communication Controller offers unparalleled quality and reliability, making it a top choice for a wide range of applications. With a maximum supply voltage of 3.6V and low power mode capabilities, this chip carrier is designed for efficiency and performance. Ensure seamless data transfer at up to 0.625 MBps with the ASYNC communication protocol. Trust NXP Semiconductors to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SC16IS752IBS,157 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can be used in a wide range of applications without the risk of voltage overload.

Address Bus Width: 2

The address bus width of 2 allows for efficient data transfer and communication, making this product suitable for tasks requiring rapid data processing.

Package Shape: SQUARE

The square package shape provides a compact design, saving space and making it easier to integrate into different systems or devices.

Power Supplies (V): 2.5/3.3

The availability of multiple power supplies allows for flexibility in power requirements, making this product adaptable to various voltage needs.

No. of Terminals: 32

With 32 terminals, this product offers ample connectivity options, making it versatile for a wide range of applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style of chip carrier, heat sink/slug, and very thin profile provides efficient heat dissipation and compactness, making this product suitable for space-constrained environments.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures energy efficiency and compatibility with a range of power sources, making this product cost-effective in terms of power consumption.

Maximum Operating Temperature: 95 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance in various settings.

Maximum Data Transfer Rate: 0.625 MBps

The high maximum data transfer rate of 0.625 MBps enables fast and efficient data communication, making this product ideal for high-speed applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function effectively in cold environments, providing versatility in temperature conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold ensures excellent conductivity and corrosion resistance, enhancing the longevity and performance of the product.

Technical Specifications

Serial Communication Controllers SC16IS752IBS,157 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

2

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

2

No. of Terminals:

32

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

SC16IS752IBS,157 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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