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SCC68681C1A44

NXP Semiconductors

SCC68681C1A44 by NXP Semiconductors

SCC68681C1A44 by NXP Semiconductors is a Serial Communication Controller with 5V power supply, 4 MHz clock frequency, and 0.125 MBps data transfer rate. It is used for asynchronous communication protocols in commercial-grade applications requiring serial I/Os and S68000 bus compatibility.

Median Price

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Lifecycle Status

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10

In-Stock Inventory

1k+

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Vyrian

USA . 5,135 parts In-Stock

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Anansix

USA . 2,780 parts In-Stock

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Digiode

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Cyclops Electronics Ltd

UK . 324 parts In-Stock

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Bristol Electronics

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Resion

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ACDS - Activité Composants Distribution Service

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Nova Conductors

Japan . 10 parts In-Stock

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Goldney Electronics S.L.

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Semtec, LLC

USA . 4 parts In-Stock

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Corohmni

South Africa . 1,059 parts In-Stock

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$2.856

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One Stop Electronics

USA . 1,035 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 470 parts In-Stock

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$14.700

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Ampacity Inc.

Singapore . 1,214 parts In-Stock

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Semicontronic

India . 955 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,411 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Bastille Electronics

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Perfect Parts

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Argo Parts USA

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GreenTree Electronics

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Overview

Transform your communication systems with the SCC68681C1A44 from NXP Semiconductors. As a leader in semiconductor manufacturing, NXP guarantees top-notch quality and reliability. This Serial Communication Controller is versatile and efficient, perfect for a wide range of applications. With fast data transfer rates and a wide operating temperature range, this product offers unmatched performance. Upgrade your systems today with the SCC68681C1A44 and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability, making it a great choice for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Operates within a safe voltage range, ensuring stable performance and protection against damage.

Address Bus Width: 4

Provides sufficient capacity for addressing different devices, enhancing flexibility in data transmission.

Package Shape: SQUARE

Compact design saves space on the circuit board, ideal for applications with limited room.

Power Supplies (V): 5

Standard voltage requirement ensures compatibility with common power sources.

No. of Terminals: 44

Sufficient number of terminals for connecting to various components, enabling versatile connectivity options.

Package Style (Meter): CHIP CARRIER

Chip carrier package offers additional protection and heat dissipation, suitable for demanding environments.

Minimum Supply Voltage: 4.75 V

Allows for operation in a wide range of voltage inputs, increasing compatibility with different systems.

Maximum Operating Temperature: 70 °C

Withstands high temperatures, making it suitable for industrial or harsh environments.

Maximum Data Transfer Rate: 0.125 MBps

High data transfer rate enables fast communication, ideal for time-sensitive applications.

Minimum Operating Temperature: 0 °C

Capable of functioning in low temperatures, ensuring reliable performance in various conditions.

Terminal Finish: Tin (Sn)

Tin finish provides corrosion resistance and good solderability, enhancing the product's longevity.

Terminal Position: QUAD

Quad terminal position offers stability and secure connections, reducing the risk of signal interruptions.

Maximum Seated Height: 4.57 mm

Low profile design saves space in compact electronic devices, suitable for slim form factors.

Width: 16.585 mm

Moderate width allows for easy integration into different circuit layouts, offering versatility in design.

Data Encoding or Decoding Method: NRZ

Non-return-to-zero encoding method ensures accurate data transmission, minimizing errors in communication.

External Data Bus Width: 8

Wide external data bus width facilitates efficient data transfer, improving overall system performance.

Communication Protocol: ASYNC, BIT

Supports popular communication protocols for seamless integration with existing systems and devices.

Maximum Clock Frequency: 4 MHz

High clock frequency enables rapid data processing, suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for ample time during reflow soldering processes, ensuring proper solder connections.

Peak Reflow Temperature °C: 245

Withstands high reflow temperatures, meeting industry standards for soldering processes.

Length: 16.585 mm

Moderate length makes it easy to fit into different circuit layouts, offering flexibility in design.

Temperature Grade: COMMERCIAL

Commercial-grade components are reliable and cost-effective, suitable for a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Integrated peripheral IC type simplifies system design and reduces the need for additional components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability.

Terminal Form: J BEND

J bend terminal form provides secure connections and ease of soldering, ensuring robust electrical connections.

Nominal Supply Voltage: 5 V

Standard nominal voltage simplifies power supply requirements, improving compatibility with other components.

No. of Serial I/Os: 2

Multiple serial I/Os enable simultaneous communication with different devices, enhancing connectivity options.

Bus Compatibility: S68000

Compatible with the S68000 bus standard, ensuring interoperability with a wide range of systems and devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies board layout and assembly, making it easy to integrate into various designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates resistance to moisture damage, ensuring reliability in humid environments.

Technical Specifications

Serial Communication Controllers SCC68681C1A44 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

4

Boundary Scan:

NO

Bus Compatibility:

S68000

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SCC68681C1A44 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-532-1904, 5962015321904

NIIN

015321904

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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