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MCP2515-E/SORB2

Microchip Technology

MCP2515-E/SORB2 by Microchip Technology

MCP2515-E/SORB2 by Microchip: Serial Communication Controller with 5.5V max supply voltage, 0.125 MBps data rate, and 40 MHz clock frequency. Ideal for automotive applications due to TS 16949 screening level and low power mode for SPI bus compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,148 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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AZTECH Wire

Italy . 202 parts In-Stock

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$14.522

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202

$14.522

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$20.965

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$19.916

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$19.916

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$20.965

$19.916

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Corohmni

South Africa . 166 parts In-Stock

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$22.901

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166

$22.901

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Ampacity Inc.

Singapore . 315 parts In-Stock

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$23.000

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315

$23.000

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Semicontronic

India . 1,579 parts In-Stock

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$31.000

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$30.225

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$30.070

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1,579

$31.000

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$30.070

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Aztec Data Supply Inc.

USA . 1,129 parts In-Stock

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$37.160

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Argo Parts USA

USA . 4,613 parts In-Stock

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Continental Prestige Electronics

USA . 4,407 parts In-Stock

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RGB Technical Solutions

Ukraine . 2,058 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Overview

Experience seamless communication with the MCP2515-E/SORB2 by Microchip Technology. As a leader in the industry, Microchip Technology ensures top-notch quality and reliability. This Serial Communication Controller offers fast data transfer rates and low power consumption, making it perfect for a wide range of applications. From automotive to industrial settings, this product provides value and efficiency to customers looking for high-performance communication solutions. Trust Microchip Technology to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight, cost-effective, and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs, making the product efficient in terms of PCB design and assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5 V, this product can handle a wide range of input voltages, providing flexibility and compatibility with different power sources.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making the product suitable for automotive and industrial applications where robust performance is required.

Package Shape: RECTANGULAR

Rectangular package shape is standard and easy to handle, allowing for straightforward integration into existing designs and systems.

No. of Terminals: 18

Having 18 terminals provides ample connectivity options for interfacing with other components, enhancing the product's versatility and compatibility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making the product ideal for compact designs where board real estate is limited.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures the product can operate efficiently even with lower power sources, improving energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C allows the product to withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

Maximum Data Transfer Rate: 0.125 MBps

With a maximum data transfer rate of 0.125 MBps, the product can handle high-speed communication requirements, enabling quick and efficient data exchange.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures the product can function in extreme cold conditions, expanding its usability in various environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-term reliability and robustness of the product.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in connection options, improving the product's reliability and ease of integration in different system configurations.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65 mm saves space on the PCB, contributing to a compact overall design and efficient use of board real estate.

Width: 7.5 mm

Narrow width of 7.5 mm allows for a slim profile, making the product suitable for applications where space constraints are a concern.

Data Encoding or Decoding Method: NRZ

Using NRZ data encoding or decoding method ensures reliable and accurate data transmission, enhancing the product's communication efficiency and error detection capabilities.

Communication Protocol: SYNC; BIT ;BYTE

Supporting SYNC, BIT, and BYTE communication protocols enables the product to interface with a wide range of devices and systems, enhancing its compatibility and versatility.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for fast data processing and communication, making the product suitable for high-speed applications that require quick response times.

Length: 11.55 mm

Compact length of 11.55 mm contributes to the product's overall small footprint, allowing for integration into space-constrained applications without compromising functionality.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures the product can withstand and operate reliably in automotive environments, making it suitable for automotive electronics and control systems.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial I/O and communication controller, this product enables serial communication with other devices, making it a versatile and essential component for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term operation.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical and electrical connections, ensuring secure and stable interfacing with other components on the PCB.

Maximum Supply Current: 10 mA

Low maximum supply current of 10 mA reduces power consumption and heat dissipation, contributing to the product's energy efficiency and reliability in operation.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying system integration and ensuring reliable and stable operation.

Bus Compatibility: SPI

SPI bus compatibility allows the product to communicate with other devices using the SPI protocol, facilitating seamless data exchange and integration in SPI-based systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm is widely used and compatible with various PCB designs, enabling easy integration of the product into different electronic applications.

Low Power Mode: YES

Having a low power mode option enhances energy efficiency and prolongs battery life, making the product suitable for portable devices and applications where power conservation is critical.

Technical Specifications

Serial Communication Controllers MCP2515-E/SORB2 attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e3

Length:

11.55 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

18

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MCP2515-E/SORB2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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