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SC28L202A1DGG,118

NXP Semiconductors

SC28L202A1DGG,118 by NXP Semiconductors

SC28L202A1DGG,118 by NXP Semiconductors is a Serial Communication Controller with 5.5V max supply voltage, 0.375 MBps data transfer rate, and 50 MHz clock frequency. Ideal for industrial applications requiring high-speed asynchronous communication in a compact package with low power mode support.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,102 parts In-Stock

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Digiode

USA . 2,804 parts In-Stock

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2,804

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Anansix

USA . 508 parts In-Stock

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508

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One Stop Electronics

USA . 1,339 parts In-Stock

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$7.000

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1,339

$7.000

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AZTECH Wire

Italy . 332 parts In-Stock

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$9.566

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332

$9.566

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$11.383

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$10.359

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$9.334

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100

$11.383

$10.359

$9.334

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Ampacity Inc.

Singapore . 1,179 parts In-Stock

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$28.000

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$28.000

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Semicontronic

India . 177 parts In-Stock

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$35.000

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$34.125

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$33.950

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177

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$34.125

$33.950

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Aztec Data Supply Inc.

USA . 2,947 parts In-Stock

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$40.780

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$40.780

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Corohmni

South Africa . 254 parts In-Stock

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$60.482

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Lixinc

USA . 12,605 parts In-Stock

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Continental Prestige Electronics

USA . 6,528 parts In-Stock

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UNI Independent Distributors

Spain . 5,675 parts In-Stock

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Microchip USA

USA . 3,970 parts In-Stock

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Corphita

USA . 3,829 parts In-Stock

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Bastille Electronics

Australia . 2,635 parts In-Stock

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Argo Parts USA

USA . 1,150 parts In-Stock

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Overview

Unlock seamless communication with the SC28L202A1DGG,118 by NXP Semiconductors. Crafted with cutting-edge technology, this Serial Communication Controller offers unparalleled reliability and performance. Ideal for industrial applications, this product boasts a high data transfer rate of 0.375 MBps and low power mode, ensuring efficiency without compromising power consumption. Say goodbye to communication barriers and experience smooth operations with the SC28L202A1DGG,118.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various applications.

Surface Mount: YES

The surface mount design allows for easy assembly and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can accommodate a wide range of power sources.

Address Bus Width: 7

The 7-bit address bus width enables efficient communication with multiple devices in the system.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB layout designs.

No. of Terminals: 56

The presence of 56 terminals allows for versatile connectivity options.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style promotes space-saving and enhances heat dissipation in compact designs.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables reliable performance in harsh environments.

Maximum Data Transfer Rate: 0.375 MBps

The high data transfer rate ensures speedy and efficient communication between devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

The dual terminal position offers redundancy and flexibility in connecting external components.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact design and easy integration into tight spaces.

Width: 6.1 mm

The width of 6.1 mm ensures compatibility with standard PCB layouts and spacing requirements.

Data Encoding or Decoding Method: NRZ

The NRZ encoding method simplifies data transmission and reception for improved efficiency.

External Data Bus Width: 8

The 8-bit external data bus width enhances data transfer speed and processing capabilities.

Communication Protocol: ASYNC, BIT

Support for asynchronous and bit-based communication protocols ensures compatibility with various systems.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows for rapid data processing and response times.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures secure soldering during assembly processes.

Length: 14 mm

The length of 14 mm provides a compact form factor for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in rugged and harsh environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

This peripheral IC type offers versatile communication capabilities for diverse applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form offers secure solder joints and easy assembly on the PCB.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard, enabling compatibility with various systems.

No. of Serial I/Os: 2

The presence of 2 serial I/Os allows for simultaneous communication with multiple devices.

Bus Compatibility: 68XXX; 80XXX

Compatibility with 68XXX and 80XXX bus systems enhances versatility and integration options.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch offers precise connectivity and alignment for reliable performance.

Low Power Mode: YES

The low power mode feature helps in reducing energy consumption and extending battery life.

Technical Specifications

Serial Communication Controllers SC28L202A1DGG,118 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

7

Boundary Scan:

NO

Bus Compatibility:

68XXX; 80XXX

Maximum Clock Frequency:

50 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

SC28L202A1DGG,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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