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SC28L194A1BE,528

NXP Semiconductors

SC28L194A1BE,528 by NXP Semiconductors

SC28L194A1BE,528 by NXP Semiconductors is a Serial Communication Controller with 80 terminals and operates at 5.5V max supply voltage. It supports data transfer rates up to 0.125 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring low power consumption and high-speed serial I/O communications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,368 parts In-Stock

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Anansix

USA . 1,509 parts In-Stock

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Digiode

USA . 749 parts In-Stock

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Nova Conductors

Japan . 61 parts In-Stock

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One Stop Electronics

USA . 1,569 parts In-Stock

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$6.000

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$6.000

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AZTECH Wire

Italy . 460 parts In-Stock

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$8.307

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460

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Ampacity Inc.

Singapore . 608 parts In-Stock

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$10.000

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Semicontronic

India . 460 parts In-Stock

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$16.000

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$15.600

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$15.520

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460

$16.000

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Microchip USA

USA . 307 parts In-Stock

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$43.716

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Aztec Data Supply Inc.

USA . 2,255 parts In-Stock

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$46.460

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Corohmni

South Africa . 989 parts In-Stock

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UNI Independent Distributors

Spain . 6,604 parts In-Stock

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Continental Prestige Electronics

USA . 5,056 parts In-Stock

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Corphita

USA . 4,449 parts In-Stock

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Bastille Electronics

Australia . 3,867 parts In-Stock

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Argo Parts USA

USA . 2,552 parts In-Stock

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Advanced Electronics

New Zealand . 95 parts In-Stock

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Overview

Unlock seamless communication and connectivity with the NXP Semiconductors SC28L194A1BE,528 Serial Communication Controller. Designed with precision and reliability in mind, this product boasts high-quality materials and cutting-edge technology. Ideal for industrial applications, this controller offers a maximum data transfer rate of 0.125 MBps and operates at a wide temperature range from -40 to 85°C. Experience the value of effortless data encoding and decoding, low power consumption, and reliable performance in a compact package. Elevate your projects with the SC28L194A1BE,528 and stay ahead in the world of serial communication controllers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the serial communication controller.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and facilitating efficient assembly.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options for the controller.

Address Bus Width: 7

Enables efficient communication with multiple devices by supporting a wide range of addresses.

Package Shape: SQUARE

Simplifies placement and alignment during assembly, contributing to overall ease of use.

No. of Terminals: 80

Offers multiple connection points for various input and output options, enhancing compatibility with different systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates tight integration on circuit boards, maintaining a compact design for space-constrained applications.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even with slightly lower power inputs, adding to the versatility of the controller.

Maximum Operating Temperature: 85 °C

Allows for use in a wide range of environments without compromising performance.

Maximum Data Transfer Rate: 0.125 MBps

Enables fast and efficient data transmission, crucial for applications requiring quick communication.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme cold conditions, increasing the controller's utility across different settings.

Terminal Finish: Tin (Sn)

Provides corrosion resistance and good electrical conductivity for reliable signal transmission.

Terminal Position: QUAD

Enhances the structural integrity of connections, reducing the risk of disconnections or signal interference.

Maximum Seated Height: 1.6 mm

Ensures a low profile design, ideal for applications with space constraints.

Width: 12 mm

Compact dimensions make it suitable for integration into a variety of electronic devices.

Data Encoding or Decoding Method: NRZ

A straightforward encoding method that simplifies data transmission and reception processes.

External Data Bus Width: 8

Supports high-speed data communication with external devices, enabling seamless information exchange.

Communication Protocol: ASYNC, BIT

Compatible with widely-used communication protocols, ensuring interoperability with other devices.

Maximum Clock Frequency: 33 MHz

Enables rapid processing of data, suitable for demanding applications that require high-speed operation.

Maximum Time At Peak Reflow Temperature (s): 30

Optimizes the soldering process during assembly, ensuring secure and reliable connections.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering, essential for proper installation onto circuit boards.

Length: 12 mm

Compact size contributes to the overall space-saving design of the controller.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications, where durability and performance in harsh conditions are essential.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed specifically for handling serial communication tasks effectively and efficiently.

Technology: CMOS

Low power consumption and high noise immunity, ideal for energy-efficient and reliable operation.

Terminal Form: GULL WING

Enhances mechanical strength and solder joint reliability, ensuring long-term performance.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of electronic systems and components.

No. of Serial I/Os: 4

Provides multiple input and output channels for versatile connectivity options.

Terminal Pitch: 0.5 mm

Fine pitch spacing allows for densely populated circuit boards, maximizing functionality in limited space.

Moisture Sensitivity Level (MSL): 2

Can withstand moderate exposure to moisture during storage or operation, improving reliability in humid environments.

Low Power Mode: YES

Supports energy-saving features for efficient power management and extended battery life in portable devices.

Technical Specifications

Serial Communication Controllers SC28L194A1BE,528 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 20 MHZ

Address Bus Width:

7

Boundary Scan:

NO

Maximum Clock Frequency:

33 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC28L194A1BE,528 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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