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MCP2515-I/STRB2

Microchip Technology

MCP2515-I/STRB2 by Microchip Technology

MCP2515-I/STRB2 by Microchip Tech is a Serial Comm Controller with 5.5V max supply voltage, 0.125 MBps data rate, and 40 MHz clock freq. It's used for SYNC/BIT/BYTE comm protocols in industrial settings, featuring low power mode and SPI bus compatibility.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 957 parts In-Stock

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957

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 1,466 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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1,466

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 531 parts In-Stock

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$14.269

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531

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Ampacity Inc.

Singapore . 1,149 parts In-Stock

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$32.000

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$32.000

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Corohmni

South Africa . 208 parts In-Stock

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$64.375

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208

$64.375

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$65.409

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$62.139

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$62.139

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300

$65.409

$62.139

$62.139

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Aztec Data Supply Inc.

USA . 3,682 parts In-Stock

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$66.580

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3,682

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West Coast Incorporated

USA . 3,527 parts In-Stock

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Continental Prestige Electronics

USA . 1,175 parts In-Stock

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Argo Parts USA

USA . 1,086 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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550

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Modulus Dynamics

Lithuania . 450 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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$11.291

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$11.291

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$11.291

350

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$11.291

$11.291

$11.291

Overview

Unlock seamless and reliable communication with the MCP2515-I/STRB2 from industry leader Microchip Technology. Designed for serial communication controllers, this innovative product offers unparalleled quality and performance. Whether you're in automotive, industrial, or consumer electronics, this device guarantees swift data transfer rates and low power consumption. Embrace the future of connectivity with MCP2515-I/STRB2 and experience unrivaled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and making the product ideal for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Screening Level: TS 16949

Compliance with TS 16949 screening level ensures high-quality manufacturing standards and reliability, making the product a dependable choice for industrial applications.

Data Encoding or Decoding Method: NRZ

Using NRZ encoding/decoding method allows for efficient data transfer rates and reliable communication, enhancing the performance of the product.

Communication Protocol: SYNC; BIT ;BYTE

Supporting multiple communication protocols like SYNC, BIT, and BYTE enables seamless integration with different systems, making the product versatile and adaptable.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency of 40 MHz, the product can handle high-speed data transfers efficiently, offering optimal performance in demanding applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style help in space-saving design, making the product suitable for compact electronic devices.

Nominal Supply Voltage: 5 V

Having a stable nominal supply voltage of 5 V ensures consistent and reliable operation, making the product a dependable choice for various applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller allows the product to efficiently manage data transmission and reception, making it an essential component for serial communication systems.

Technical Specifications

Serial Communication Controllers MCP2515-I/STRB2 attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

SYNC; BIT ;BYTE

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

MCP2515-I/STRB2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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