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LAN9500I-ABZJ-TR

Microchip Technology

LAN9500I-ABZJ-TR by Microchip Technology

LAN9500I-ABZJ-TR by Microchip Technology is a Serial Communication Controller with 56 terminals, supporting data transfer rates up to 60 MBps. It operates b/w -40 to 85 °C and has low power mode. Ideal for PCI and USB bus compatibility, this CMOS technology chip carrier is suitable for high-speed communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 5,000 parts In-Stock

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Nova Conductors

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Vyrian

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AZTECH Wire

Italy . 445 parts In-Stock

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$14.649

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Corohmni

South Africa . 207 parts In-Stock

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Aztec Data Supply Inc.

USA . 326 parts In-Stock

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Kepictronics

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QUARKTWIN TECHNOLOGY LTD

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LOOK Integrated Logistics

Peru . 7,855 parts In-Stock

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Montano Global Distributors

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Continental Prestige Electronics

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NIA Electronics

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Advanced Electronics

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Argo Parts USA

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Bastille Electronics

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Microchip USA

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Overview

Step up your communication game with the LAN9500I-ABZJ-TR by Microchip Technology. This high-quality Serial Communication Controller is designed for maximum performance and reliability. With a blazing fast data transfer rate of 60 MBps and low power mode, this product offers unparalleled value to customers in various applications such as PCI and USB bus compatibility. Trust Microchip Technology to deliver top-notch solutions for all your communication needs. Elevate your projects with the LAN9500I-ABZJ-TR today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.6 V

Compatible with a wide range of power sources, ensuring versatility and flexibility in different applications.

On Chip Data RAM Width: 32

Sufficient on-chip memory for efficient data processing and storage, enhancing performance.

Package Shape: SQUARE

Compact and space-saving package design suitable for modern electronic devices.

No. of Terminals: 56

Sufficient number of terminals for connecting various external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides effective heat dissipation and compact form factor, ideal for small and high-performance devices.

Minimum Supply Voltage: 3 V

Supports lower power operation while still maintaining reliable performance.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial and harsh environments.

Maximum Data Transfer Rate: 60 MBps

High data transfer speed for efficient communication and data processing tasks.

Minimum Operating Temperature: -40 °C

Able to operate in cold temperatures, ensuring reliability in extreme conditions.

Terminal Position: QUAD

Quad-terminal position for easy and secure connection of external devices.

Maximum Seated Height: 1 mm

Low profile design for slim and compact device layouts.

RAM Words: 7168

Sufficient RAM capacity for storing and processing large amounts of data.

Width: 8 mm

Compact width for space-efficient integration into electronic systems.

Boundary Scan: YES

Provides debugging and testing capabilities for improved development and maintenance.

Data Encoding or Decoding Method: NRZI

Efficient data encoding method for reliable communication and data integrity.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast and responsive data processing.

Length: 8 mm

Compact length for space-saving device designs.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Versatile peripheral IC type for diverse communication and networking applications.

Technology: CMOS

CMOS technology for low power consumption and high-speed performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmentally friendly and RoHS compliant applications.

Nominal Supply Voltage: 3.3 V

Stable and compatible supply voltage for reliable operation.

No. of Serial I/Os: 4

Multiple serial I/O ports for versatile connectivity options.

Bus Compatibility: PCI; USB

Support for popular bus interfaces for easy integration with various systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and compact device designs.

Low Power Mode: YES

Energy-efficient low power mode for extended battery life and reduced power consumption.

No. of I/O Lines: 11

Sufficient number of I/O lines for flexible and versatile system configurations.

Technical Specifications

Serial Communication Controllers LAN9500I-ABZJ-TR attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

YES

Bus Compatibility:

PCI; USB

Maximum Clock Frequency:

25 MHz

Data Encoding or Decoding Method:

NRZI

Maximum Data Transfer Rate:

60 MBps

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N56

Length:

8 mm

Low Power Mode:

YES

No. of I/O Lines:

11

No. of Serial I/Os:

4

No. of Terminals:

56

On Chip Data RAM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

7168

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

LAN9500I-ABZJ-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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