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SC26C92C1B,557

NXP Semiconductors

SC26C92C1B,557 by NXP Semiconductors

NXP Semiconductors SC26C92C1B,557 is a Serial Communication Controller with 5.5V max supply voltage, 0.125 MBps data transfer rate, and 8 MHz clock frequency. Ideal for applications requiring asynchronous communication protocols and low power mode operation in commercial temperature grades.

Median Price

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Lifecycle Status

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4

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1k+

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 570 parts In-Stock

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Vigor

Singapore . 204 parts In-Stock

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Microchip USA

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AZTECH Wire

Italy . 402 parts In-Stock

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One Stop Electronics

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

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Corphita

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Overview

Elevate your serial communication capabilities with the SC26C92C1B,557 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This Serial Communication Controller is versatile and efficient, offering seamless data transfer at a maximum rate of 0.125 MBps. Whether you're working on IoT devices, industrial automation, or telecommunications equipment, this product provides unmatched value, performance, and ease of use. Upgrade your projects today with the SC26C92C1B,557 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to various environmental factors, making this product a reliable choice.

Surface Mount: YES

The surface mount capability enables easy and efficient integration into electronic circuits, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can accommodate a wide range of power sources, increasing its versatility in different applications.

Address Bus Width: 4

The 4 address bus width allows for efficient data processing and communication within the system, enhancing overall performance.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for applications with limited space constraints.

Power Supplies (V): 5

The standard 5V power supply ensures compatibility with common power sources, making this product easy to integrate into existing systems.

No. of Terminals: 44

The ample number of terminals offer flexibility in connection options, allowing for versatile configurations and compatibility with various setups.

Technical Specifications

Serial Communication Controllers SC26C92C1B,557 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

2.1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

SC26C92C1B,557 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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