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SC16IS752IPW-F

NXP Semiconductors

SC16IS752IPW-F by NXP Semiconductors

SC16IS752IPW-F by NXP Semiconductors is a Serial Communication Controller with 28 terminals, operating at temperatures from -40 to 95°C. It features dual terminal position, Gull Wing form, and supports power supplies of 2.5/3.3V. Ideal for industrial applications requiring serial I/O communication control in a small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,718 parts In-Stock

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2,718

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Vyrian

USA . 691 parts In-Stock

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691

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Anansix

USA . 154 parts In-Stock

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154

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 573 parts In-Stock

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$2.000

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573

$2.000

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Ampacity Inc.

Singapore . 1,472 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 691 parts In-Stock

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$14.144

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691

$14.144

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Semicontronic

India . 1,260 parts In-Stock

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$17.000

100+ parts

$16.575

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$16.490

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1,260

$17.000

$16.575

$16.490

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$49.590

100+ parts

$45.127

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$40.664

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2,000

$49.590

$45.127

$40.664

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Corohmni

South Africa . 10 parts In-Stock

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$60.082

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10

$60.082

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Aztec Data Supply Inc.

USA . 2,716 parts In-Stock

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$82.890

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$82.890

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UNI Independent Distributors

Spain . 6,941 parts In-Stock

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Continental Prestige Electronics

USA . 5,573 parts In-Stock

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Corphita

USA . 1,010 parts In-Stock

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Argo Parts USA

USA . 927 parts In-Stock

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Bastille Electronics

Australia . 182 parts In-Stock

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Overview

Unlock seamless communication with the SC16IS752IPW-F by NXP Semiconductors. This high-quality Serial Communication Controller offers unparalleled reliability and performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this versatile device provides the perfect solution for efficient data transmission. With its advanced features and robust design, the SC16IS752IPW-F delivers exceptional value and benefits to customers looking for a reliable and cost-effective communication solution. Trust NXP Semiconductors to elevate your connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and resistance to environmental factors, making it a reliable choice for industrial applications.

Surface Mount: YES

The ability to be surface mounted allows for easy integration onto PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor that is compatible with a wide range of electronic devices and systems.

Power Supplies (V): 2.5/3.3

The dual power supply options of 2.5V and 3.3V offer flexibility in voltage requirements, accommodating a variety of system configurations.

No. of Terminals: 28

With 28 terminals available, this product offers ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style contributes to space-saving design and efficient PCB layout.

Maximum Operating Temperature: 95 °C

The high maximum operating temperature of 95°C ensures reliable performance in harsh environments or under heavy workloads.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in extreme cold conditions without compromising functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent corrosion resistance and conductivity for long-lasting performance.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB mounting orientations, allowing for greater design versatility.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product is built to withstand demanding operating conditions and ensure reliable performance.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The integrated serial IO/communication controller enhances data transfer efficiency and streamlines communication processes in electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure attachment to the PCB, ensuring a reliable electrical connection.

Terminal Pitch: 0.635 mm

With a small terminal pitch of 0.635mm, this product enables high-density mounting and space-efficient PCB design.

Technical Specifications

Serial Communication Controllers SC16IS752IPW-F attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SC16IS752IPW-F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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