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SC16IS762IPW-F

NXP Semiconductors

SC16IS762IPW-F by NXP Semiconductors

SC16IS762IPW-F by NXP Semiconductors is a Serial Communication Controller with 28 terminals, operating at temperatures from -40 to 95°C. It features a power supply of 2.5/3.3V and Gull Wing terminal form, suitable for industrial applications requiring serial IO/communication control in a small outline package.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Digiode

USA . 1,313 parts In-Stock

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Vyrian

USA . 586 parts In-Stock

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Anansix

USA . 451 parts In-Stock

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Nova Conductors

Japan . 70 parts In-Stock

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One Stop Electronics

USA . 449 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 511 parts In-Stock

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$5.286

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Ampacity Inc.

Singapore . 500 parts In-Stock

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$19.000

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$43.746

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$39.809

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$35.872

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UNI Independent Distributors

Spain . 7,969 parts In-Stock

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Argo Parts USA

USA . 3,240 parts In-Stock

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Corphita

USA . 2,436 parts In-Stock

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Bastille Electronics

Australia . 218 parts In-Stock

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Continental Prestige Electronics

USA . 67 parts In-Stock

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Overview

Unlock the power of seamless serial communication with the SC16IS762IPW-F by NXP Semiconductors. Designed with precision and reliability in mind, this Serial Communication Controller offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this versatile chip delivers value and efficiency like no other. Say goodbye to communication bottlenecks and hello to smooth, uninterrupted data transfer with the SC16IS762IPW-F.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides excellent durability and resistance to environmental factors, making the product suitable for industrial applications.

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and simplifying manufacturing processes.

Power Supplies (V): 2.5/3.3

Supports a wide range of power supplies, providing flexibility in different system configurations.

No. of Terminals: 28

Sufficient number of terminals for versatile connectivity options, enabling the controller to interface with multiple devices.

Maximum Operating Temperature: 95 °C

High maximum operating temperature ensures reliability and performance in harsh industrial environments.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme conditions without compromising functionality.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed specifically for serial communication tasks, providing efficient and reliable data transmission.

Terminal Form: GULL WING

Gull wing terminals offer secure and reliable connections, reducing the risk of signal interference or disconnection.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density packaging and increased signal integrity, suitable for compact electronic devices.

Technical Specifications

Serial Communication Controllers SC16IS762IPW-F attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SC16IS762IPW-F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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