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SC26C92C1B,528

NXP Semiconductors

SC26C92C1B,528 by NXP Semiconductors

SC26C92C1B,528 by NXP Semiconductors is a Serial Communication Controller with 5.5V max supply voltage, 0.125 MBps data transfer rate, and 8 MHz clock frequency. Ideal for applications requiring asynchronous communication protocol and low power mode in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,481 parts In-Stock

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Anansix

USA . 2,044 parts In-Stock

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Digiode

USA . 501 parts In-Stock

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501

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,036 parts In-Stock

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$14.000

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1,036

$14.000

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One Stop Electronics

USA . 239 parts In-Stock

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$16.000

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AZTECH Wire

Italy . 220 parts In-Stock

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$17.452

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$17.452

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Microchip USA

USA . 120 parts In-Stock

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$31.788

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$31.788

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$39.072

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$35.556

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$32.039

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$39.072

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$32.039

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$53.020

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QUARKTWIN TECHNOLOGY LTD

USA . 4,541 parts In-Stock

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Corphita

USA . 2,339 parts In-Stock

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Argo Parts USA

USA . 1,040 parts In-Stock

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UNI Independent Distributors

Spain . 894 parts In-Stock

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Continental Prestige Electronics

USA . 415 parts In-Stock

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Bastille Electronics

Australia . 160 parts In-Stock

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Overview

Enhance your communication systems with the SC26C92C1B,528 by NXP Semiconductors. This high-quality Serial Communication Controller offers unparalleled reliability and performance, making it the ideal choice for a wide range of applications. From data encoding to asynchronous communication protocols, this product delivers seamless connectivity and efficiency. With a low power mode and maximum data transfer rate of 0.125 MBps, customers can enjoy both value and innovation in one compact package. Upgrade your technology today with the SC26C92C1B,528.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability makes it easier to integrate into circuit boards.

Maximum Supply Voltage: 5.5 V

Ability to handle up to 5.5V supply voltage provides flexibility in power requirements.

Address Bus Width: 4

A 4-bit address bus width allows for efficient communication with other components.

Package Shape: SQUARE

Square package shape simplifies PCB layout and component placement.

No. of Terminals: 44

The high number of terminals enables multiple connections for versatile functionality.

Package Style (Meter): FLATPACK

Flatpack package style provides a compact form factor for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The ability to operate at as low as 4.5V supply voltage enhances compatibility with various systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures reliability in challenging environments.

Maximum Data Transfer Rate: 0.125 MBps

Fast data transfer rate of 0.125 MBps facilitates efficient communication between devices.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C allows for operation in cold environments.

Terminal Finish: TIN

The use of tin for terminal finish ensures good electrical conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position provides stability and ease of soldering during assembly.

Maximum Seated Height: 2.1 mm

Low maximum seated height of 2.1mm contributes to a slim profile for the product.

Width: 10 mm

Compact width of 10mm enables efficient use of space on the PCB.

Data Encoding or Decoding Method: NRZ

Use of NRZ data encoding/decoding method ensures accurate and reliable communication.

External Data Bus Width: 8

An 8-bit external data bus width allows for efficient data transfer between the product and external devices.

Communication Protocol: ASYNC, BIT

Support for both asynchronous communication and bit-wise transmission increases compatibility with various systems.

Maximum Clock Frequency: 8 MHz

High maximum clock frequency of 8 MHz enables fast data processing and communication.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering during manufacturing.

Length: 10 mm

Compact length of 10mm contributes to a space-efficient design for the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specialized peripheral IC type for serial I/O communication provides dedicated functionality for serial data transfer.

Technology: CMOS

Use of CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and ensures reliable electrical connections.

Maximum Supply Current: 25 mA

Maximum supply current of 25 mA allows for efficient power usage and operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent performance of the product.

No. of Serial I/Os: 2

Two serial I/Os provide flexibility in connecting multiple serial devices for data transfer.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm allows for high-density mounting on the PCB.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates the product's resistance to moisture during handling and storage.

Low Power Mode: YES

Support for low power mode enhances energy efficiency and prolongs battery life in portable devices.

No. of I/O Lines: 15

Fifteen I/O lines provide sufficient connectivity options for interfacing with external devices.

Technical Specifications

Serial Communication Controllers SC26C92C1B,528 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY

Address Bus Width:

4

Boundary Scan:

NO

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

15

No. of Serial I/Os:

2

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

2.1 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SC26C92C1B,528 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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