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MCP2517FDT-H/JHAVAO

Microchip Technology

MCP2517FDT-H/JHAVAO by Microchip Technology

MCP2517FDT-H/JHAVAO by Microchip is a Serial Communication Controller with 1 MBps data transfer rate, CAN FD protocol, and 40 MHz clock frequency. Ideal for LAN applications, it operates b/w -40 to 150 °C with low power mode and SPI bus compatibility.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

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10k+ parts

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98

$1.940

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-

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Vyrian

USA . 4,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,532

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,909 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

-

10k+ parts

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3,909

$1.940

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-

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Continental Prestige Electronics

USA . 309 parts In-Stock

1+ parts

$1.940

100+ parts

-

1k+ parts

-

10k+ parts

$1.901

309

$1.940

-

-

$1.901

Modulus Dynamics

Lithuania . 24 parts In-Stock

1+ parts

$2.153

100+ parts

$2.132

1k+ parts

$2.067

10k+ parts

-

24

$2.153

$2.132

$2.067

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Ampacity Inc.

Singapore . 4,828 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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10k+ parts

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4,828

$2.500

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Semicontronic

India . 4,650 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

4,650

$2.500

$2.438

$2.425

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Aztec Data Supply Inc.

USA . 4,073 parts In-Stock

1+ parts

$27.860

100+ parts

-

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4,073

$27.860

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$29.272

100+ parts

$27.808

1k+ parts

$27.808

10k+ parts

-

2,500

$29.272

$27.808

$27.808

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Corohmni

South Africa . 63 parts In-Stock

1+ parts

$62.675

100+ parts

-

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63

$62.675

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Component Stockers USA

USA . 768 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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10k+ parts

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768

$99.990

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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RGB Technical Solutions

Ukraine . 1,123 parts In-Stock

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1,123

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.901

1k+ parts

$1.843

10k+ parts

$1.804

1,000

-

$1.901

$1.843

$1.804

Robosynatics

Brazil . 250 parts In-Stock

1+ parts

-

100+ parts

$5.480

1k+ parts

$5.480

10k+ parts

$5.480

250

-

$5.480

$5.480

$5.480

Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$5.480

1k+ parts

$5.480

10k+ parts

$5.480

250

-

$5.480

$5.480

$5.480

Overview

Revolutionize your communication control with the MCP2517FDT-H/JHAVAO by Microchip Technology. As a leader in serial communication controllers, Microchip Technology ensures top-quality products that deliver unparalleled performance and reliability. This versatile device is perfect for a wide range of applications, offering high-speed data transfer rates and low power consumption. Say goodbye to connectivity issues and hello to seamless communication with the MCP2517FDT-H/JHAVAO. Elevate your projects and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and robustness, making the product suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, increasing flexibility in design and application.

On Chip Data RAM Width: 8

The 8-bit data RAM width allows for efficient data processing and storage, enhancing the overall performance of the controller.

Screening Level: AEC-Q100; TS 16949

This screening level ensures high quality and reliability, meeting automotive industry standards for robustness and longevity.

Package Shape: RECTANGULAR

The rectangular package shape provides easy integration into existing systems and compact placement on PCBs.

No. of Terminals: 14

With 14 terminals, this controller offers versatile connectivity options for external devices and peripherals.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile design, along with a heat sink/slug, optimize thermal management and space-saving in crowded environments.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows for efficient power consumption, making it suitable for low-power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliable performance.

Maximum Data Transfer Rate: 1 MBps

The high data transfer rate enables fast and efficient communication between connected devices, improving overall system responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold environments, making it suitable for a wide range of applications.

Terminal Position: DUAL

The dual terminal position provides redundancy for secure connections, reducing the risk of signal loss or interruption.

Maximum Seated Height: 0.9 mm

The low seated height profile allows for compact integration in space-constrained designs, maximizing PCB real estate.

RAM Words: 2048

With 2048 RAM words, this product offers ample memory capacity for data storage and processing, enabling complex operations and multitasking.

Width: 3 mm

The compact width dimension ensures easy fitment in tight spaces or PCB layouts, enhancing flexibility in system design.

Communication Protocol: CAN FD

The CAN FD communication protocol offers high-speed and reliable data transmission, ideal for automotive and industrial applications.

Maximum Clock Frequency: 40 MHz

The high clock frequency allows for quick signal processing and data exchange, improving system throughput and efficiency.

Length: 4.5 mm

The short length dimension facilitates space-saving designs and compact arrangements on PCBs, reducing overall footprint.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

With serial IO and LAN peripheral IC types, this controller provides versatile and multifunctional connectivity options for diverse applications.

Technology: CMOS

The CMOS technology employed ensures low power consumption, high reliability, and compatibility with modern digital systems.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process and enhances reliability by eliminating potential solder joint failure points.

Maximum Supply Current: 20 mA

With a low maximum supply current requirement, this product operates efficiently and conserves power during operation.

Bus Compatibility: SPI

The SPI bus compatibility allows for easy interfacing with a wide range of devices, enabling seamless communication and data exchange.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density board layouts, promoting space optimization and efficient signal routing.

Low Power Mode: YES

The low power mode feature enhances energy efficiency and prolongs battery life in portable or low-power applications.

No. of I/O Lines: 2

With 2 I/O lines, this controller supports basic input and output operations, providing essential connectivity options for external peripherals.

Technical Specifications

Serial Communication Controllers MCP2517FDT-H/JHAVAO attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

SPI

Maximum Clock Frequency:

40 MHz

Communication Protocol:

CAN FD

Maximum Data Transfer Rate:

1 MBps

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-N14

Length:

4.5 mm

Low Power Mode:

YES

No. of I/O Lines:

2

No. of Serial I/Os:

1

No. of Terminals:

14

On Chip Data RAM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

2048

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.9 mm

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MCP2517FDT-H/JHAVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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