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5962H9211802QZX

Texas Instruments

5962H9211802QZX by Texas Instruments

Texas Instruments' 5962H9211802QZX is a MIL-PRF-38535 Class Q compliant Serial Communication Controller with 16-bit address bus width, 0.125 MBps data transfer rate, and 24 MHz clock frequency. Ideal for military applications requiring MIL STD 1553A/B communication protocol support and low power mode operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,717 parts In-Stock

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Vyrian

USA . 2,239 parts In-Stock

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2,239

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Distributors (Availability)

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Native Components

USA . 894 parts In-Stock

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$0.645

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$0.645

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Northwest PG Solutions

USA . 770 parts In-Stock

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$0.709

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770

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One Stop Electronics

USA . 696 parts In-Stock

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$2.000

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696

$2.000

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AZTECH Wire

Italy . 363 parts In-Stock

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$9.951

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363

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Parana Technologies

USA . 1,938 parts In-Stock

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$35.769

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$35.769

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DigiPath Technology Company

USA . 628 parts In-Stock

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$39.386

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628

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ChromeModa Solutions

Germany . 1,102 parts In-Stock

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$40.190

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$32.956

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IDEA Electronic Components Group

UK . 1,088 parts In-Stock

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$40.190

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$38.180

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$36.171

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Corphita

USA . 4,490 parts In-Stock

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Overview

Enhance your communication systems with the Texas Instruments 5962H9211802QZX, a top-of-the-line Serial Communication Controller designed for reliability and performance. Manufactured by Texas Instruments, a trusted name in the industry, this product offers military-grade quality and precision. Ideal for a wide range of applications, this controller provides seamless data transfer at high speeds, ensuring efficient operation. Experience the value and benefits of cutting-edge technology with the Texas Instruments 5962H9211802QZX - the ultimate solution for all your communication needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a printed circuit board, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

Operates efficiently within a safe voltage range, ensuring stable performance and protection against overvoltage.

Maximum Data Transfer Rate: 0.125 MBps

High data transfer rate allows for quick and reliable communication between devices, increasing overall system efficiency.

Communication Protocol: MIL STD 1553A; MIL STD 1553B

Compliant with military communication standards, ensuring interoperability and compatibility with a wide range of systems in defense applications.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, making it suitable for harsh environments and military-grade applications.

Technical Specifications

Serial Communication Controllers 5962H9211802QZX attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

Communication Protocol:

MIL STD 1553A; MIL STD 1553B

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

16

JESD-30 Code:

S-XQFP-F132

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

132

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

3.3 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Total Dose (V):

1M Rad(Si)

Trade Compliance

5962H9211802QZX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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