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5962-9752901NXA

Texas Instruments

5962-9752901NXA by Texas Instruments

The Texas Instruments 5962-9752901NXA is a Serial Communication Controller with 32-bit address and data bus width, operating at up to 50 MHz clock frequency. It is designed for military-grade applications requiring high-speed data transfer rates of up to 50 MBps. The package style is a flatpack with low profile and fine pitch, suitable for surface mount assembly in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,714 parts In-Stock

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4,714

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Digiode

USA . 4,445 parts In-Stock

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4,445

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Distributors (Availability)

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One Stop Electronics

USA . 1,480 parts In-Stock

1+ parts

$5.000

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1,480

$5.000

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AZTECH Wire

Italy . 612 parts In-Stock

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$9.996

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612

$9.996

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Parana Technologies

USA . 2,197 parts In-Stock

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$65.314

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$65.314

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DigiPath Technology Company

USA . 1,101 parts In-Stock

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$71.919

100+ parts

$66.166

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1,101

$71.919

$66.166

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ChromeModa Solutions

Germany . 2,150 parts In-Stock

1+ parts

$73.387

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$60.177

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2,150

$73.387

$60.177

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IDEA Electronic Components Group

UK . 636 parts In-Stock

1+ parts

$73.387

100+ parts

$69.718

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$66.048

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636

$73.387

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$66.048

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Corphita

USA . 4,052 parts In-Stock

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Northwest PG Solutions

USA . 2,117 parts In-Stock

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Native Components

USA . 788 parts In-Stock

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Overview

Unlock the power of seamless communication with the Texas Instruments 5962-9752901NXA Serial Communication Controller. Manufactured by a trusted industry leader, this high-quality device offers unparalleled performance and reliability. Ideal for a wide range of applications, this controller delivers lightning-fast data transfer rates of up to 50 MBps, making it perfect for mission-critical tasks. Experience the value and benefits that only Texas Instruments can provide with this cutting-edge product. Elevate your communication capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the serial communication controller.

Surface Mount: YES

Allows for easy and secure mounting onto printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of compatible power sources, increasing flexibility in system integration.

Address Bus Width: 32

Enables the controller to handle large amounts of memory addresses, enhancing data processing capabilities.

Package Shape: SQUARE

Provides a compact form factor for efficient use of space in electronic devices.

No. of Terminals: 176

Offers a sufficient number of connection points for interfacing with other components in the system.

Maximum Data Transfer Rate: 50 MBps

Ensures fast and efficient communication between the controller and connected devices, reducing latency.

Maximum Operating Temperature: 125 °C

Suitable for operation in harsh environments where high temperatures may be encountered.

Minimum Operating Temperature: -55 °C

Capable of functioning reliably in extreme cold conditions, making it versatile for various applications.

Technology: CMOS

Utilizes low power consumption and high noise immunity, resulting in efficient performance and reliability.

Technical Specifications

Serial Communication Controllers 5962-9752901NXA attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

50 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e0

Length:

24 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Trade Compliance

5962-9752901NXA Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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