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5962H9211802QXA

Texas Instruments

5962H9211802QXA by Texas Instruments

Texas Instruments' 5962H9211802QXA is a MIL-PRF-38535 Class Q serial communication controller with 16-bit address bus width and max clock frequency of 24 MHz. Ideal for military applications, it supports MIL STD 1553A/B protocols and operates in temperatures ranging from -55 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,200 parts In-Stock

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Digiode

USA . 3,830 parts In-Stock

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3,830

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Distributors (Availability)

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Native Components

USA . 591 parts In-Stock

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$2.140

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Northwest PG Solutions

USA . 2,083 parts In-Stock

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$2.354

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One Stop Electronics

USA . 400 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 642 parts In-Stock

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$19.820

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Parana Technologies

USA . 462 parts In-Stock

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$67.420

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462

$67.420

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DigiPath Technology Company

USA . 45 parts In-Stock

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$74.238

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$68.299

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45

$74.238

$68.299

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ChromeModa Solutions

Germany . 5,384 parts In-Stock

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$75.753

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$62.117

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IDEA Electronic Components Group

UK . 896 parts In-Stock

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$75.753

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$71.965

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$68.178

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Corphita

USA . 2,804 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the Texas Instruments 5962H9211802QXA serial communication controller. Crafted with precision using top-notch materials, this MILITARY-grade device is designed to excel in demanding environments. From aerospace to defense applications, this controller ensures seamless data transfer at a blazing speed of 0.125 MBps. Trust Texas Instruments for cutting-edge technology that delivers unmatched value and efficiency, setting you apart from the competition. Elevate your projects with the Texas Instruments 5962H9211802QXA - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability for the product, making it suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of supply voltage, increasing compatibility with different systems.

Address Bus Width: 16

Wide address bus width allows for efficient communication and processing of data.

Screening Level: MIL-PRF-38535 Class Q

High screening level ensures reliability and quality that meets military standards.

Package Shape: RECTANGULAR

Rectangular shape provides ease of integration into various systems.

No. of Terminals: 84

Sufficient number of terminals for versatile connections and configurations.

Package Style (Meter): GRID ARRAY

Grid array package style allows for compact and efficient layout on a circuit board.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage helps in conserving power and extending battery life.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures product reliability in various environmental conditions.

Maximum Data Transfer Rate: 0.125 MBps

Efficient data transfer rate allows for quick and reliable communication.

Minimum Operating Temperature: -55 °C

Wide temperature range ensures product functionality in extreme cold conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability for terminal connections.

Terminal Position: PERPENDICULAR

Perpendicular terminal position allows for easy access and connection.

Boundary Scan: YES

Boundary scan capability helps in testing and diagnosing the product during development and production.

Data Encoding or Decoding Method: BIPH-LEVEL(MANCHESTER)

Efficient encoding/decoding method ensures accurate data transmission and reception.

External Data Bus Width: 16

Wide external data bus width allows for efficient data transfer and processing.

Communication Protocol: MIL STD 1553A; MIL STD 1553B

Compliant with standard communication protocols used in military and aerospace applications.

Maximum Clock Frequency: 24 MHz

High clock frequency allows for fast processing and communication speed.

Temperature Grade: MILITARY

Designed to meet military-grade standards for reliability and performance in demanding environments.

Total Dose (V): 1M Rad(Si)

High total dose tolerance makes the product suitable for use in radiation-intensive environments.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553

Specialized peripheral IC type for serial communication control in military applications.

Technology: CMOS

CMOS technology ensures low power consumption and high performance.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure and reliable connections for external devices.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with various systems and devices.

No. of Serial I/Os: 2

Multiple serial I/Os allow for versatile connectivity and data transfer options.

Low Power Mode: YES

Low power mode feature helps in conserving energy and extending battery life for portable devices.

Technical Specifications

Serial Communication Controllers 5962H9211802QXA attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

Communication Protocol:

MIL STD 1553A; MIL STD 1553B

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

16

JESD-30 Code:

R-CPGA-P84

JESD-609 Code:

e0

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

PERPENDICULAR

Total Dose (V):

1M Rad(Si)

Trade Compliance

5962H9211802QXA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-471-3226, 5962014713226

NIIN

014713226

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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