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5962H9211802QXC

Texas Instruments

5962H9211802QXC by Texas Instruments

The Texas Instruments 5962H9211802QXC is a MIL-PRF-38535 Class Q serial communication controller with 16-bit address and external data bus width. Operating b/w -55 to 125 °C, it supports MIL STD 1553A/B protocols at a clock frequency of up to 24 MHz. Ideal for military applications requiring low power consumption and high data transfer rates.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,581 parts In-Stock

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Digiode

USA . 1,786 parts In-Stock

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AZTECH Wire

Italy . 510 parts In-Stock

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$10.353

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One Stop Electronics

USA . 736 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,030 parts In-Stock

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$58.118

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DigiPath Technology Company

USA . 1,073 parts In-Stock

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$63.995

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$58.875

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ChromeModa Solutions

Germany . 3,666 parts In-Stock

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$65.301

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$53.547

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

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$65.301

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$62.036

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$58.771

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Northwest PG Solutions

USA . 2,053 parts In-Stock

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Corphita

USA . 1,452 parts In-Stock

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Native Components

USA . 842 parts In-Stock

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Overview

Elevate your communication systems with the Texas Instruments 5962H9211802QXC Serial Communication Controller. As a trusted manufacturer, Texas Instruments delivers top-notch quality and reliability in every product. Ideal for military applications, this controller offers high-speed data transfer rates, low power consumption, and exceptional temperature tolerance. With advanced features like boundary scan and compatibility with MIL-STD-1553 protocols, this device ensures seamless and secure communications. Upgrade your systems today with Texas Instruments and experience unparalleled performance and value.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability in harsh environments, making this product suitable for military applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product can handle higher voltage levels without risk of damage, providing flexibility in power supply options.

Address Bus Width: 16

The 16-bit address bus width allows for efficient communication and addressing of data, enhancing the overall performance of the controller.

Screening Level: MIL-PRF-38535 Class Q

Meeting MIL-PRF-38535 Class Q screening level standards ensures the product's reliability and quality, making it a trusted choice for critical military applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, ensuring consistent performance under extreme conditions.

Data Encoding or Decoding Method: BIPH-LEVEL(MANCHESTER)

The use of BIPH-LEVEL (MANCHESTER) data encoding or decoding method facilitates accurate and efficient data transmission, enhancing the reliability of communication in critical applications.

Communication Protocol: MIL STD 1553A; MIL STD 1553B

Supporting MIL STD 1553A and MIL STD 1553B communication protocols ensures compatibility with standard military communication interfaces, making this product a reliable choice for military systems.

Total Dose (V): 1M Rad(Si)

With a total dose of 1M Rad(Si), this product is designed to withstand radiation exposure, making it suitable for use in space or other high-radiation environments.

Technical Specifications

Serial Communication Controllers 5962H9211802QXC attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

24 MHz

Communication Protocol:

MIL STD 1553A; MIL STD 1553B

Data Encoding or Decoding Method:

BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

16

JESD-30 Code:

R-CPGA-P84

JESD-609 Code:

e4

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

84

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

PERPENDICULAR

Total Dose (V):

1M Rad(Si)

Trade Compliance

5962H9211802QXC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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