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5962-9755001QXX

Texas Instruments

5962-9755001QXX by Texas Instruments

Texas Instruments' 5962-9755001QXX is a Serial Communication Controller with 3-bit address bus width, operating b/w -55 to 125 °C. It supports 0.125 MBps data transfer rate, ASYNC and BIT communication protocols, ideal for military-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,764 parts In-Stock

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Digiode

USA . 573 parts In-Stock

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AZTECH Wire

Italy . 304 parts In-Stock

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$7.876

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$7.876

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Native Components

USA . 497 parts In-Stock

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$16.420

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Northwest PG Solutions

USA . 534 parts In-Stock

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$18.062

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$16.255

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One Stop Electronics

USA . 1,057 parts In-Stock

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$19.000

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Parana Technologies

USA . 2,316 parts In-Stock

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$22.767

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$23.431

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$22.767

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DigiPath Technology Company

USA . 1,349 parts In-Stock

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$25.069

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$23.064

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$25.069

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IDEA Electronic Components Group

UK . 2,357 parts In-Stock

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$25.581

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$24.302

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$23.023

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ChromeModa Solutions

Germany . 1,592 parts In-Stock

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$25.581

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$20.976

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Corphita

USA . 4,478 parts In-Stock

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Overview

Elevate your serial communication systems with the 5962-9755001QXX by Texas Instruments. Crafted with the highest quality materials and cutting-edge technology, this serial communication controller offers unparalleled reliability and performance. From military-grade applications to industrial automation, this versatile device ensures seamless data transfer at lightning-fast speeds. Experience the value and benefits of Texas Instruments' expertise in every interaction with this exceptional product. Upgrade your operations today with the 5962-9755001QXX.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring reliability in various environmental conditions.

Surface Mount: YES

Allows for easy and secure mounting on a printed circuit board, saving space and facilitating automated assembly.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs without getting damaged, providing flexibility in power supply options.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level data transfer, making it suitable for various applications requiring precise data handling.

Maximum Clock Frequency: 16 MHz

Enables high-speed data processing, ensuring efficient communication between devices.

Technical Specifications

Serial Communication Controllers 5962-9755001QXX attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ENHANCED BIDIRECTIONAL PRINTER PORT

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-GQFP-F68

Length:

12.51 mm

Low Power Mode:

NO

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

3.912 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

12.51 mm

Trade Compliance

5962-9755001QXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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