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5962-9958101QXC

Texas Instruments

5962-9958101QXC by Texas Instruments

The Texas Instruments 5962-9958101QXC is a MILITARY-grade SERIAL IO/COMMUNICATION CONTROLLER with 180 terminals in a GRID ARRAY package. It operates b/w -55 to 125 °C and supports SYNC, BIT, BYTE communication protocols. Ideal for military applications requiring reliable serial communication at supply voltages ranging from 4.75V to 5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

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1k+

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Verical

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Vyrian

USA . 4,938 parts In-Stock

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Anansix

USA . 752 parts In-Stock

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Digiode

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Native Components

USA . 224 parts In-Stock

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AZTECH Wire

Italy . 853 parts In-Stock

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One Stop Electronics

USA . 302 parts In-Stock

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$22.000

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Parana Technologies

USA . 1,165 parts In-Stock

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$55.645

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IDEA Electronic Components Group

UK . 1,148 parts In-Stock

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$62.523

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$59.397

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$56.271

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ChromeModa Solutions

Germany . 160 parts In-Stock

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$62.523

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$51.269

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Corphita

USA . 1,061 parts In-Stock

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DigiPath Technology Company

USA . 906 parts In-Stock

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Northwest PG Solutions

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the 5962-9958101QXC, a top-of-the-line Serial Communication Controller. This military-grade component offers seamless communication protocols and operates in extreme temperatures, making it ideal for a wide range of applications. With its advanced technology and robust construction, this product ensures optimal performance and long-term durability. Trust Texas Instruments to deliver exceptional value and unmatched benefits with every purchase.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent durability and reliability, making this product suitable for harsh operating environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance allows for flexibility in voltage input, ensuring stable performance and protection against voltage spikes.

Screening Level: MIL-STD-883

The MIL-STD-883 screening level ensures that the product meets stringent military standards for quality and reliability, making it ideal for mission-critical applications.

No. of Terminals: 180

The high number of terminals provides extensive connectivity options, allowing for versatile integration and communication capabilities.

Package Style (Meter): GRID ARRAY

The grid array package style offers compact size and efficient layout, optimizing space utilization and facilitating easy PCB mounting.

Temperature Grade: MILITARY

The military-grade temperature rating ensures operation in extreme temperature conditions, making this product suitable for rugged military and aerospace applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance, enhancing efficiency and reducing heat generation for improved overall system stability.

Nominal Supply Voltage: 5 V

The nominal supply voltage compatibility with standard 5V systems ensures easy integration and compatibility with various existing hardware setups.

Technical Specifications

Serial Communication Controllers 5962-9958101QXC attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Boundary Scan:

NO

Communication Protocol:

SYNC; BIT ;BYTE

JESD-30 Code:

X-CPGA-P180

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

180

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Qualified

Screening Level:

MIL-STD-883

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

PERPENDICULAR

Trade Compliance

5962-9958101QXC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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