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SC16C554BIB80

NXP Semiconductors

SC16C554BIB80 by NXP Semiconductors

SC16C554BIB80 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage, 0.625 MBps data transfer rate, and 80MHz clock frequency. Ideal for industrial applications requiring high-speed asynchronous communication over 4 serial I/Os in a compact 12x12mm flatpack package.

Median Price

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Lifecycle Status

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In-Stock Inventory

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Digiode

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Vyrian

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Anansix

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Univa Technologies Pte. Ltd

Singapore . 1,071 parts In-Stock

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Chip Stock

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Nova Conductors

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NexGen Digital

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Ampacity Inc.

Singapore . 824 parts In-Stock

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One Stop Electronics

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Corohmni

South Africa . 163 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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UNI Independent Distributors

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Robosynatics

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Lucentia Tech

USA . 4,594 parts In-Stock

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Argo Parts USA

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Corphita

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Aranea Global

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Lixinc

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Continental Prestige Electronics

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Overview

Enhance your communication systems with the SC16C554BIB80 from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Serial Communication Controllers that offer reliable performance and seamless integration. Ideal for a wide range of applications, this product provides customers with unmatched value, benefits, and advantages. Upgrade your systems today with the SC16C554BIB80 and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to damage, making this product suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and flexible installation on circuit boards, saving space and minimizing assembly time.

Maximum Supply Voltage: 3.63 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in usage.

Address Bus Width: 3

The address bus width of 3 enables efficient communication between different components, enhancing overall system performance.

Package Shape: SQUARE

The square package shape is compact and versatile, making it easier to handle and integrate into various electronic devices.

Power Supplies (V): 2.5/5

The dual power supply options of 2.5V and 5V allow for compatibility with different electronic systems, offering versatility in design.

No. of Terminals: 80

With a high number of terminals, this product supports multiple connections and interfaces, enabling complex communication setups.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enhances thermal performance, minimizes signal distortion, and allows for high-density mounting.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures efficient power consumption and proper functionality even under variable voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance of 85°C ensures reliability and stability in harsh environmental conditions.

Maximum Data Transfer Rate: 0.625 MBps

The high data transfer rate of 0.625 MBps enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality and reliability in extreme cold conditions.

Terminal Finish: Tin (Sn)

The tin terminal finish provides corrosion resistance and good solderability, ensuring long-term connection stability.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and minimizes signal interference, improving overall system performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm saves space and allows for compact design integration in electronic devices.

Width: 12 mm

The compact width of 12 mm allows for versatile placement and integration into different electronic systems, optimizing space usage.

External Data Bus Width: 8

The wide external data bus width of 8 enables high-speed data transfer and efficient communication between different components.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer ensures compatibility and flexibility in various communication setups.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency of 80 MHz offers fast data processing capabilities, enhancing system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and component stability during manufacturing processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable soldering and component attachment during assembly, ensuring long-term product performance.

Length: 12 mm

The compact length of 12 mm enables space-saving design integration and versatile placement options in electronic systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures stability and reliability in harsh operating environments, making this product suitable for industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

The peripheral IC type of serial IO/communication controller offers advanced serial communication capabilities, enhancing connectivity and data transfer efficiency.

Technology: CMOS

The CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of electronic systems, ensuring efficient operation.

Terminal Form: GULL WING

The gullwing terminal form offers robust mechanical support and facilitates easy soldering during assembly, ensuring reliable connections and long-term performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable power delivery and compatibility with standard electronic components, enhancing system reliability.

No. of Serial I/Os: 4

The four serial I/Os enable versatile communication options and multi-device connectivity, enhancing system flexibility and functionality.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting and efficient signal routing, optimizing PCB space and design layout.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates moderate sensitivity to moisture, requiring proper handling and storage, ensuring component integrity.

Technical Specifications

Serial Communication Controllers SC16C554BIB80 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V AND 5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC16C554BIB80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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