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SC16C650BIBS,128

NXP Semiconductors

SC16C650BIBS,128 by NXP Semiconductors

SC16C650BIBS,128 by NXP Semiconductors is a Serial Communication Controller with 32 terminals and 8-bit external data bus width. It operates b/w -40 to 85 °C, supporting a max clock frequency of 48 MHz for communication protocols like ASYNC and BIT. Ideal for industrial applications requiring low power mode and high-speed data transfer up to 0.375 MBps.

Median Price

$4.588

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,440 parts In-Stock

1+ parts

-

100+ parts

$3.670

1k+ parts

$3.280

10k+ parts

$3.090

18,440

-

$3.670

$3.280

$3.090

DigiKey

USA . 18,440 parts In-Stock

1+ parts

-

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$4.830

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18,440

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$4.830

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Verical

USA . 9,574 parts In-Stock

1+ parts

-

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$4.588

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$4.100

10k+ parts

$3.862

9,574

-

$4.588

$4.100

$3.862

Distributors (In-Stock)

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Digiode

USA . 4,119 parts In-Stock

1+ parts

$3.876

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4,119

$3.876

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Flip Electronics

USA . 12,000 parts In-Stock

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Vyrian

USA . 6,749 parts In-Stock

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6,749

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Anansix

USA . 796 parts In-Stock

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796

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Vigor

Singapore . 5,426 parts In-Stock

1+ parts

$3.230

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5,426

$3.230

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Semicontronic

India . 6,531 parts In-Stock

1+ parts

$3.470

100+ parts

$3.383

1k+ parts

$3.366

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-

6,531

$3.470

$3.383

$3.366

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Ampacity Inc.

Singapore . 6,235 parts In-Stock

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$3.470

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$3.470

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Corphita

USA . 4,851 parts In-Stock

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$3.672

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$3.672

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Corohmni

South Africa . 691 parts In-Stock

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$4.939

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691

$4.939

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Microchip USA

USA . 7,213 parts In-Stock

1+ parts

$25.410

100+ parts

$25.250

1k+ parts

$25.170

10k+ parts

$25.100

7,213

$25.410

$25.250

$25.170

$25.100

Aztec Data Supply Inc.

USA . 2,466 parts In-Stock

1+ parts

$26.670

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2,466

$26.670

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Perfect Parts

USA . 26,880 parts In-Stock

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26,880

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Continental Prestige Electronics

USA . 5,676 parts In-Stock

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5,676

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UNI Independent Distributors

Spain . 4,149 parts In-Stock

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4,149

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Bastille Electronics

Australia . 266 parts In-Stock

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266

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Argo Parts USA

USA . 228 parts In-Stock

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Overview

Unlock seamless communication with the SC16C650BIBS,128 by NXP Semiconductors. Crafted with precision and reliability in mind, this Serial Communication Controller offers unparalleled performance in a compact package. From industrial automation to IoT devices, this chip is designed to elevate connectivity and streamline data transfer at a blazing speed of 0.375 MBps. Experience the power of innovation with the SC16C650BIBS,128 and revolutionize your projects with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, reducing assembly time and complexity.

Maximum Supply Voltage: 5.5 V

Ability to handle high supply voltages provides flexibility in power source selection and improves overall reliability.

Address Bus Width: 3

A wider address bus width allows for efficient data transfer and processing, enhancing the performance of the communication controller.

Package Shape: SQUARE

Square package shape provides a compact footprint, enabling space-saving design and integration in tight layouts.

Power Supplies (V): 2.5/5

Support for multiple power supply voltages allows for compatibility with different systems and voltage requirements.

No. of Terminals: 32

Large number of terminals offer versatile connectivity options and enable interfacing with various external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management, component protection, and space efficiency.

Minimum Supply Voltage: 4.5 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources and prevents damage from lower voltage levels.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation in demanding industrial environments without risk of overheating.

Maximum Data Transfer Rate: 0.375 MBps

High data transfer rate facilitates fast and efficient communication, reducing latency and improving overall system performance.

Minimum Operating Temperature: -40 °C

Wide temperature range support from -40°C ensures functionality in harsh cold environments, making this communication controller versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and durability for long-term reliability and signal integrity.

Terminal Position: QUAD

Quad terminal position enhances stability and connectivity, ensuring secure connections and reducing the risk of signal interference.

Maximum Seated Height: 1 mm

Low maximum seated height minimizes the overall profile of the component, allowing for compact and space-efficient system designs.

Width: 5 mm

Narrow width dimension enables a slim form factor, making this communication controller suitable for compact devices and space-constrained applications.

External Data Bus Width: 8

Wide external data bus width enables high-speed data transfer and processing, improving efficiency and performance in data communication.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level operation ensures compatibility with various systems and simplifies data transmission.

Maximum Clock Frequency: 48 MHz

High maximum clock frequency provides fast signal processing and response time, enhancing the overall speed and performance of the communication controller.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature minimizes heat exposure during assembly, preventing component damage and ensuring reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables robust soldering and ensures secure component attachment during manufacturing processes.

Length: 5 mm

Compact length dimension contributes to a small form factor, allowing for flexibility in system integration and layout design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating certifies reliable operation in harsh industrial environments, making this communication controller suitable for rugged applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed as a serial IO/communication controller, this peripheral IC offers versatile interface options and efficient data handling for serial communication tasks.

Technology: CMOS

CMOS technology ensures low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the efficiency and reliability of the communication controller.

Terminal Form: NO LEAD

No-lead terminal form provides environmental benefits, eliminates potential lead contamination, and offers improved solder joint reliability.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V ensures consistent and reliable performance, supporting the proper functioning of the communication controller.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for precise connections and compact layout design, ensuring secure and reliable electrical connections.

Low Power Mode: YES

Capability to operate in low power mode conserves energy, extends battery life, and reduces power consumption, making this communication controller energy-efficient.

Technical Specifications

Serial Communication Controllers SC16C650BIBS,128 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V OR 3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

48 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Serial I/Os:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

SC16C650BIBS,128 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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