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TL16C550BIFN

Texas Instruments

TL16C550BIFN by Texas Instruments

TL16C550BIFN by Texas Instruments is a Serial Communication Controller with 44 terminals, operating at 3.072 MHz clock frequency. It supports data transfer rate of 0.0686 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring high-speed serial I/O communication.

Median Price

$7.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 20 parts In-Stock

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$7.000

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DF Sales Co.

USA . 20 parts In-Stock

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$7.000

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Digiode

USA . 4,510 parts In-Stock

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Vyrian

USA . 3,018 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 21 parts In-Stock

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MISTER SPROCKETS

USA . 16 parts In-Stock

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Beltway Electronics Company

USA . 13 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 132 parts In-Stock

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$16.000

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$16.000

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AZTECH Wire

Italy . 625 parts In-Stock

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$17.426

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$17.426

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Ampacity Inc.

Singapore . 1,479 parts In-Stock

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$27.000

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Corohmni

South Africa . 1,101 parts In-Stock

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$44.728

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Parana Technologies

USA . 430 parts In-Stock

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$73.239

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$6,801.351

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$65.915

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430

$73.239

$6,801.351

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DigiPath Technology Company

USA . 470 parts In-Stock

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$80.645

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$74.194

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ChromeModa Solutions

Germany . 2,281 parts In-Stock

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$82.291

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$67.479

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IDEA Electronic Components Group

UK . 846 parts In-Stock

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$82.291

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$78.176

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$74.062

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,109 parts In-Stock

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Netroflash

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Corphita

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Overview

Elevate your communication capabilities with the TL16C550BIFN by Texas Instruments. Crafted with precision and expertise, this serial communication controller offers seamless data transmission for a variety of applications. From industrial settings to consumer electronics, this product delivers reliable performance and efficiency. Trust in Texas Instruments' reputation for quality and innovation as you experience the value and benefits that the TL16C550BIFN brings to your projects. Unlock new possibilities with this versatile component that ensures smooth and reliable communication every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging provides durability and protection for the serial communication controller, ensuring long-term reliability.

Surface Mount: YES

The surface mount capability allows for easy and stable installation on printed circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, increasing flexibility in application scenarios.

Address Bus Width: 3

A wider address bus allows for efficient data handling and processing, enabling faster and more complex communication tasks.

Package Shape: SQUARE

The square package shape simplifies placement and alignment during installation, reducing the chance of errors and improving overall reliability.

Power Supplies (V): 5

The standard 5V power supply requirement makes integration with existing systems and components straightforward, enhancing ease of use and compatibility.

No. of Terminals: 44

The ample number of terminals allows for versatile connectivity options and supports a diverse range of communication configurations, making the controller suitable for various applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact and efficient form factor, ideal for space-constrained environments while maintaining robust performance.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage requirement ensures efficient power consumption and compatibility with different power sources, enhancing overall system flexibility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range provides reliability in diverse environmental conditions, making the controller suitable for industrial applications where temperature fluctuations may occur.

Maximum Data Transfer Rate: 0.068603515625 MBps

The high data transfer rate enables fast and efficient communication, facilitating seamless data exchange in real-time applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows the controller to function reliably in harsh and extreme temperature conditions, ensuring consistent performance in a variety of operating environments.

Terminal Position: QUAD

The quad terminal position layout simplifies connections and cabling, reducing installation complexity and ensuring proper alignment for efficient communication.

Maximum Seated Height: 4.57 mm

The low maximum seated height facilitates compact system designs and allows for efficient integration in space-limited applications.

Width: 16.5862 mm

The moderate width dimension enables easy integration into standard PCB layouts, providing compatibility with industry-standard configurations.

Data Encoding or Decoding Method: NRZ

The use of non-return-to-zero (NRZ) encoding ensures accurate data transmission and reception, reducing the likelihood of errors and enhancing communication reliability.

External Data Bus Width: 8

An external data bus width of 8 bits allows for efficient data processing and transfer, enabling high-speed communication and supporting a wide range of data types and formats.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocols and bit-based data transfer enhances compatibility with various systems and devices, enabling seamless connectivity and data exchange.

Maximum Clock Frequency: 3.072 MHz

The high maximum clock frequency capability enables rapid data processing and communication speed, facilitating real-time data exchange and high-performance applications.

Length: 16.5862 mm

The compact length dimension allows for easy integration in tight spaces and on small PCBs, making the controller suitable for applications with limited physical footprint.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable operation in demanding environmental conditions, making the controller suitable for rugged industrial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Designed as a specialized serial I/O and communication controller, the peripheral IC enhances serial data handling capabilities and facilitates seamless communication in serial-based systems.

Technology: MOS

Based on MOS technology, the controller offers energy-efficient operation and high-speed performance, making it well-suited for power-conscious and high-performance applications.

Terminal Form: J BEND

The J bend terminal form simplifies soldering and connection processes, ensuring secure and reliable terminal connections for stable communication performance.

Maximum Supply Current: 10 mA

With a low maximum supply current requirement, the controller operates efficiently and consumes minimal power, contributing to overall system energy savings.

Nominal Supply Voltage: 5 V

The standard 5V nominal supply voltage simplifies power management and integration with existing systems, enhancing compatibility and ease of use.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, reducing the risk of electrical interference and ensuring reliable communication links.

Technical Specifications

Serial Communication Controllers TL16C550BIFN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

3.072 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.068603515625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

TL16C550BIFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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