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TL16C450FN

Texas Instruments

TL16C450FN by Texas Instruments

TL16C450FN by Texas Instruments is a serial communication controller with 44 terminals, operating at 5V. It supports data transfer rates up to 0.03125 MBps and features NRZ encoding method. Ideal for applications requiring asynchronous communication protocols and a max clock frequency of 3.072 MHz.

Median Price

$5.295

Lifecycle Status

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53

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1k+

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Mouser Electronics

USA . 469 parts In-Stock

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DigiKey

USA . 117 parts In-Stock

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Rochester

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Verical

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Component Electronics Inc.

Canada . 27 parts In-Stock

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Digiode

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TEDSS.com

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DigiKey Marketplace

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Ampacity Inc.

Singapore . 18,478 parts In-Stock

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$2.410

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Semicontronic

India . 18,420 parts In-Stock

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$2.410

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$2.350

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$2.338

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Corphita

USA . 3,465 parts In-Stock

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Corohmni

South Africa . 224 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

Germany . 4,908 parts In-Stock

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IDEA Electronic Components Group

UK . 1,019 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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USA . 823 parts In-Stock

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Overview

Unlock seamless and reliable serial communication with the TL16C450FN by Texas Instruments. Crafted with precision and expertise, this serial communication controller offers unmatched quality and performance. Ideal for a variety of applications, this chip carrier package boasts a maximum data transfer rate of 0.03125 MBps, making it the perfect choice for those seeking efficient and fast communication solutions. Experience the value and benefits of Texas Instruments technology with the TL16C450FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Epoxy material provides excellent protection for the internal components of the controller, ensuring durability and reliability.

Maximum Supply Voltage: 5.25 V

Ability to handle high voltage inputs allows for versatility in different application scenarios.

Maximum Data Transfer Rate: 0.03125 MBps

High data transfer rate enables quick and efficient communication between devices.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol offers flexibility in data transfer and synchronization.

Technology: CMOS

CMOS technology ensures low power consumption and compatibility with various digital systems.

Technical Specifications

Serial Communication Controllers TL16C450FN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

3.072 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.03125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of I/O Lines:

0

No. of Serial I/Os:

1

No. of Terminals:

44

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.585 mm

Trade Compliance

TL16C450FN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-465-9063, 5962014659063

NIIN

014659063

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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