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LAN9253T-I/R4X

Microchip Technology

LAN9253T-I/R4X by Microchip Technology

LAN9253T-I/R4X by Microchip Technology is a Serial Communication Controller with 16-bit Address Bus, 12.5 MBps Data Transfer Rate, and SYNC/BYTE Communication Protocol. It is ideal for low power applications requiring high-speed data transfer over I2C/SPI buses at temperatures ranging from -40 to 85 °C.

Median Price

$16.879

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$16.879

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100

$16.879

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Vyrian

USA . 6,577 parts In-Stock

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6,577

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,131 parts In-Stock

1+ parts

$16.879

100+ parts

-

1k+ parts

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10k+ parts

$16.542

6,131

$16.879

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-

$16.542

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$16.879

100+ parts

$16.542

1k+ parts

-

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1,000

$16.879

$16.542

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AZTECH Wire

Italy . 149 parts In-Stock

1+ parts

$20.970

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149

$20.970

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Aztec Data Supply Inc.

USA . 2,532 parts In-Stock

1+ parts

$22.060

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2,532

$22.060

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Semicontronic

India . 1,186 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

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1,186

$34.000

$33.150

$32.980

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Corohmni

South Africa . 113 parts In-Stock

1+ parts

$48.463

100+ parts

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113

$48.463

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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10,000

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Argo Parts USA

USA . 3,919 parts In-Stock

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3,919

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Fulton Briggs Corp.

USA . 2,381 parts In-Stock

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2,381

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Overview

Upgrade your devices with the LAN9253T-I/R4X by Microchip Technology for reliable and efficient serial communication control. With a maximum data transfer rate of 12.5 MBps and low power mode, this chip carrier with a very thin profile offers seamless integration and top-notch performance. Perfect for applications requiring high-speed data transfer and synchronization, this product ensures maximum supply voltage of 1.26 V and operates in temperatures ranging from -40 to 85°C. Trust in Microchip Technology's expertise in delivering quality components for your next project.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy integration into compact electronic devices, making this product ideal for space-constrained applications.

Maximum Supply Voltage: 1.26 V

With a maximum supply voltage of 1.26 V, this product offers efficient power consumption and compatibility with low-power circuits.

Address Bus Width: 16

A wide address bus width of 16 enables efficient data processing and communication, making this product suitable for high-speed applications.

Package Shape: SQUARE

The square package shape provides easy handling and mounting, making this product convenient for assembly and installation.

No. of Terminals: 64

With 64 terminals, this product offers ample connectivity options, making it versatile for a wide range of system configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management and space-saving features, making this product a reliable and efficient solution.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures reliable operation in low-power scenarios, making this product suitable for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions, ensuring robust performance in various applications.

Maximum Data Transfer Rate: 12.5 MBps

The high maximum data transfer rate of 12.5 MBps facilitates quick and efficient communication, making this product ideal for data-intensive tasks.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C allows this product to function in extreme cold environments, enhancing its versatility for use in diverse settings.

Technical Specifications

Serial Communication Controllers LAN9253T-I/R4X attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

I2C; SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE

Data Encoding or Decoding Method:

NRZI

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

LAN9253T-I/R4X Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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