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SCC2691AC1D24,118

NXP Semiconductors

SCC2691AC1D24,118 by NXP Semiconductors

NXP Semiconductors' SCC2691AC1D24,118 is a Serial Communication Controller with 5.5V max supply voltage, 4MHz clock frequency, and 0.0046875 MBps data transfer rate. Widely used in serial IO/communication applications due to its low power mode, ASYNC/BIT communication protocol support, and CMOS technology for reliable performance.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 3,708 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

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AZTECH Wire

Italy . 262 parts In-Stock

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One Stop Electronics

USA . 517 parts In-Stock

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Ampacity Inc.

Singapore . 152 parts In-Stock

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Argo Parts USA

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Corphita

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 3,329 parts In-Stock

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Bastille Electronics

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Overview

Boost your communication system with the SCC2691AC1D24,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-notch quality and reliability. This Serial Communication Controller is perfect for a wide range of applications, providing seamless data transfer at a high speed of 0.0046875 MBps. With low power mode included, this product offers exceptional value and benefits to customers looking for efficient and dependable solutions. Upgrade your system today with the SCC2691AC1D24,118!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the controller, ensuring long-term reliability.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it compatible with various systems and applications.

Data Encoding or Decoding Method: NRZ

NRZ (Non-Return-to-Zero) encoding method ensures efficient data transmission and reliable communication.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication protocol and bit-level transfer, enabling flexible and versatile data exchange.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the controller energy-efficient and reliable.

Technical Specifications

Serial Communication Controllers SCC2691AC1D24,118 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Low Power Mode:

YES

No. of Serial I/Os:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SCC2691AC1D24,118 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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