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SJA1000TD

NXP Semiconductors

SJA1000TD by NXP Semiconductors

NXP Semiconductors' SJA1000TD is a Serial Communication Controller with 8-bit address bus width and 24 MHz clock frequency. Widely used in automotive applications, it supports data transfer rates up to 0.125 MBps and operates b/w -40 to 125 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,256 parts In-Stock

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Vyrian

USA . 1,567 parts In-Stock

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Anansix

USA . 1,022 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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QIE Inc.

USA . 2 parts In-Stock

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Ampacity Inc.

Singapore . 257 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 428 parts In-Stock

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One Stop Electronics

USA . 202 parts In-Stock

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$12.000

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Semicontronic

India . 1,334 parts In-Stock

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$22.000

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$21.450

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$21.340

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Aztec Data Supply Inc.

USA . 571 parts In-Stock

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$30.090

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$69.341

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$65.874

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Corohmni

South Africa . 397 parts In-Stock

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Continental Prestige Electronics

USA . 4,553 parts In-Stock

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Corphita

USA . 1,431 parts In-Stock

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Argo Parts USA

USA . 604 parts In-Stock

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UNI Independent Distributors

Spain . 290 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Enhance your automotive communication systems with the SJA1000TD by NXP Semiconductors! This high-quality Serial Communication Controller offers reliable performance and seamless data transfer at a maximum rate of 0.125 MBps. Designed for automotive applications, this product ensures optimal connectivity and efficiency, making it a valuable asset for your projects. Trust in NXP Semiconductors' expertise and take advantage of the innovative features and benefits that the SJA1000TD has to offer. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and resistance to physical damage, making this product a reliable choice for long-term use.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5V provides flexibility in power input options, making this product suitable for a wide range of applications.

Address Bus Width: 8

The 8-bit address bus width allows for efficient communication and data handling, enhancing the overall performance of the product.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard mounting procedures and layout designs, facilitating integration into various systems.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable functionality in harsh environments, making this product suitable for rugged applications.

Data Encoding or Decoding Method: NRZ

The NRZ data encoding/decoding method ensures efficient and accurate transmission of data, improving the overall performance of the communication controller.

Maximum Clock Frequency: 24 MHz

The high maximum clock frequency of 24 MHz enables fast data transfer rates, making this product ideal for applications requiring high-speed communication.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The peripheral IC type of serial IO/communication controller with LAN capability enhances connectivity and communication options, making this product versatile for various networking applications.

Technical Specifications

Serial Communication Controllers SJA1000TD attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

8

Boundary Scan:

NO

Maximum Clock Frequency:

24 MHz

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Low Power Mode:

YES

No. of Serial I/Os:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

SJA1000TD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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