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SCC2691AC1D24-T

NXP Semiconductors

SCC2691AC1D24-T by NXP Semiconductors

SCC2691AC1D24-T by NXP Semiconductors is a Serial Communication Controller with 24 terminals, operating at 4 MHz clock frequency. It supports data transfer rates up to 0.0046875 MBps and has a low power mode for energy efficiency. Ideal for asynchronous communication protocols in various commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 2,555 parts In-Stock

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Anansix

USA . 1,190 parts In-Stock

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Vyrian

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Nova Conductors

Japan . 37 parts In-Stock

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Prism Electronics

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AZTECH Wire

Italy . 748 parts In-Stock

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One Stop Electronics

USA . 969 parts In-Stock

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Ampacity Inc.

Singapore . 1,199 parts In-Stock

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Bastille Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Overview

Elevate your communication systems with the SCC2691AC1D24-T by NXP Semiconductors. Designed with precision and expertise, this serial communication controller offers seamless data transfer at a blazing speed of 0.0046875 MBps. Perfect for a variety of applications, this small outline package provides customers with reliability, efficiency, and top-notch performance. Say goodbye to connectivity issues and hello to a world of possibilities with the SCC2691AC1D24-T from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the controller.

Surface Mount: YES

Allows for easy and secure PCB mounting, saving space and facilitating automated assembly.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, increasing compatibility with different systems.

Address Bus Width: 3

Sufficient address bus width for efficient communication with peripheral devices.

Package Shape: RECTANGULAR

Standard package shape that fits well with common PCB layouts.

No. of Terminals: 24

Adequate number of terminals for connecting to various components in a system.

Maximum Seated Height: 2.65 mm

Low profile design helps in minimizing overall system height.

Maximum Data Transfer Rate: 0.0046875 MBps

Decent data transfer rate for serial communication tasks.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication and bit-level control.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specifically designed for managing serial communication tasks effectively.

Technical Specifications

Serial Communication Controllers SCC2691AC1D24-T attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

4 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.0046875 MBps

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

1

No. of Serial I/Os:

1

No. of Terminals:

24

On Chip Data RAM Width:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

RAM Words:

0

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SCC2691AC1D24-T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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