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LAN7850T/4F

Microchip Technology

LAN7850T/4F by Microchip Technology

LAN7850T/4F by Microchip Tech: 125 MBps data rate, 25 MHz clock freq, SYNC/BYTE Ethernet protocol. Ideal for serial communication apps with CMOS tech, low power mode, and boundary scan feature. Operates b/w 0-70 °C in commercial grade settings.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 1,354 parts In-Stock

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Nova Conductors

Japan . 73 parts In-Stock

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AZTECH Wire

Italy . 548 parts In-Stock

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Semicontronic

India . 1,407 parts In-Stock

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$14.625

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$14.550

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Ampacity Inc.

Singapore . 582 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,360 parts In-Stock

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Corohmni

South Africa . 3 parts In-Stock

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Montano Global Distributors

Canada . 4,271 parts In-Stock

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Continental Prestige Electronics

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LOOK Integrated Logistics

Peru . 2,216 parts In-Stock

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LMD Electronica

Estonia . 1,672 parts In-Stock

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Argo Parts USA

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NIA Electronics

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Ledger Components

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Bastille Electronics

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Overview

Enhance your connectivity with the LAN7850T/4F by Microchip Technology, a leading manufacturer in the industry. This Serial Communication Controller offers seamless communication protocols such as SYNC, BYTE, and Ethernet, ensuring fast data transfer rates of up to 125 MBps. With a low power mode and commercial temperature grade, this versatile product is perfect for a wide range of applications. Experience unmatched quality, reliability, and performance with the LAN7850T/4F - the ideal solution for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the controller, making it suitable for various applications.

Maximum Supply Voltage: 1.26 V

Allows for a higher voltage input, providing flexibility in powering the controller.

Screening Level: TS 16949

Ensures high quality and reliability due to compliance with the TS 16949 screening standard.

Maximum Data Transfer Rate: 125 MBps

Enables high-speed data transfer, making it ideal for applications requiring quick communication.

Communication Protocol: SYNC, BYTE; ETHERNET

Supports multiple communication protocols, increasing compatibility with various systems.

Maximum Clock Frequency: 25 MHz

Allows for fast processing and response times, improving overall performance.

Low Power Mode: YES

Offers energy-saving capabilities, reducing power consumption and extending battery life.

Technical Specifications

Serial Communication Controllers LAN7850T/4F attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Maximum Data Transfer Rate:

125 MBps

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

11

No. of Serial I/Os:

0

No. of Terminals:

56

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

LAN7850T/4F Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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