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SAFC165UTAH-LF

Infineon Technologies

SAFC165UTAH-LF by Infineon Technologies

SAFC165UTAH-LF by Infineon Technologies is a 16-bit serial communication controller with 2.25 MBps data transfer rate, operating at temperatures from -40 to 85 °C. It features a 3.3 V power supply, suitable for industrial applications requiring low profile and fine pitch packaging in a compact form factor of 20x20 mm.

Median Price

$14.700

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 35,186 parts In-Stock

1+ parts

$14.700

100+ parts

$14.410

1k+ parts

$14.110

10k+ parts

-

35,186

$14.700

$14.410

$14.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 945 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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945

-

-

-

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Vyrian

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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390

-

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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10

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 184 parts In-Stock

1+ parts

$7.000

100+ parts

-

1k+ parts

-

10k+ parts

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184

$7.000

-

-

-

Microchip USA

USA . 2,324 parts In-Stock

1+ parts

$24.895

100+ parts

-

1k+ parts

-

10k+ parts

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2,324

$24.895

-

-

-

Modulus Dynamics

Lithuania . 1,510 parts In-Stock

1+ parts

$31.343

100+ parts

$30.089

1k+ parts

$28.836

10k+ parts

-

1,510

$31.343

$30.089

$28.836

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,000

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Continental Prestige Electronics

USA . 2,473 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,473

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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Corphita

USA . 787 parts In-Stock

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787

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Argo Parts USA

USA . 38 parts In-Stock

1+ parts

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38

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Overview

Unlock the potential of your communication systems with the SAFC165UTAH-LF by Infineon Technologies. With a reputation for excellence in manufacturing, this serial communication controller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides customers with high-speed data transfer capabilities, low power consumption, and industrial-grade performance. Experience the value and benefits of seamless communication with the SAFC165UTAH-LF, designed to elevate your systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability to the product, making it suitable for various environmental conditions.

Surface Mount: YES

Ease of installation and space-saving design.

Maximum Supply Voltage: 3.63 V

Allows for higher voltage applications.

Address Bus Width: 21

Allows for greater memory addressing capability.

Package Shape: SQUARE

Efficient use of space and easy integration into circuit boards.

Bit Size: 16

Suitable for handling 16-bit data processing efficiently.

Power Supplies (V): 3.3

Optimal power supply for the component's operation.

No. of Terminals: 144

Sufficient connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact design and efficient PCB layout.

Minimum Supply Voltage: 2.97 V

Provides a safe operating range for the component.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with higher temperature requirements.

CPU Family: 80166

Specific compatibility and optimization with the specified CPU family.

Maximum Data Transfer Rate: 2.25 MBps

High-speed data transfer capability for efficient communication.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments.

Terminal Position: QUAD

Facilitates secure and stable connection with other devices.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Width: 20 mm

Compact form factor for efficient PCB layout.

Boundary Scan: YES

Allows for testing and debugging of the component during operation.

External Data Bus Width: 16

Matches the bit size for seamless data transfer.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; SYNC, HDLC

Supports multiple communication standards for versatility.

Maximum Clock Frequency: 36 MHz

High clock frequency for rapid data processing.

Peak Reflow Temperature °C: 245

Sufficient thermal capacity for reflow soldering processes.

Length: 20 mm

Balanced dimensions for compact design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specialized for serial communication tasks.

RAM Bytes: 3072

Adequate memory for data storage and processing.

Technology: CMOS

Ensures low power consumption and high noise immunity.

Terminal Form: GULL WING

Secure and reliable terminal connection.

Maximum Supply Current: 150 mA

Moderate power consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable power supply for consistent performance.

No. of Serial I/Os: 2

Allows for multiple serial connections.

Terminal Pitch: 0.5 mm

Fine pitch for compact layout and high-density integration.

Moisture Sensitivity Level (MSL): 3

Suitable for handling moderate levels of moisture during operation.

Speed: 36 rpm

Capable of high-speed operation for efficient data processing.

Low Power Mode: YES

Enables energy-saving operation when high performance is not required.

Technical Specifications

Serial Communication Controllers SAFC165UTAH-LF attributes and parameters. Explore more Serial Communication Controllers devices from Infineon Technologies

Specs

Address Bus Width:

21

Bit Size:

16

Boundary Scan:

YES

CPU Family:

80166

Maximum Clock Frequency:

36 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC

Maximum Data Transfer Rate:

2.25 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

3072

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

SAFC165UTAH-LF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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