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SAFC165H-LF

Infineon Technologies

SAFC165H-LF by Infineon Technologies

SAFC165H-LF by Infineon Technologies is a 16-bit serial communication controller with 2.25 MBps data transfer rate, suitable for industrial applications. Operating at 36 MHz clock frequency, it features a low profile flatpack package with 144 terminals and supports async and sync communication protocols.

Median Price

$16.315

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 31,595 parts In-Stock

1+ parts

-

100+ parts

$14.090

1k+ parts

$12.610

10k+ parts

$11.860

31,595

-

$14.090

$12.610

$11.860

DigiKey

USA . 31,595 parts In-Stock

1+ parts

-

100+ parts

$18.540

1k+ parts

-

10k+ parts

-

31,595

-

$18.540

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 509 parts In-Stock

1+ parts

$14.906

100+ parts

-

1k+ parts

-

10k+ parts

-

509

$14.906

-

-

-

Vyrian

USA . 474 parts In-Stock

1+ parts

$15.690

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$15.690

-

-

-

NexGen Digital

USA . 538 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

538

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 91 parts In-Stock

1+ parts

$14.121

100+ parts

-

1k+ parts

-

10k+ parts

-

91

$14.121

-

-

-

Microchip USA

USA . 5,769 parts In-Stock

1+ parts

$42.170

100+ parts

$41.570

1k+ parts

$41.260

10k+ parts

$40.960

5,769

$42.170

$41.570

$41.260

$40.960

Modulus Dynamics

Lithuania . 2,510 parts In-Stock

1+ parts

$79.342

100+ parts

$76.168

1k+ parts

$72.995

10k+ parts

-

2,510

$79.342

$76.168

$72.995

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Elevate your communication systems with the SAFC165H-LF by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality Serial Communication Controllers like no other. This versatile product opens up a world of possibilities for various applications, offering customers unmatched value and benefits. Experience seamless data transfer, reliable performance, and cutting-edge technology with the SAFC165H-LF. Step into the future of connectivity with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.63 V

The higher supply voltage allows for more stable operation and better performance of the product.

Package Shape: SQUARE

The square shape of the package makes it easier to handle and integrate into different circuit designs.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a specialized communication controller, this product is optimized for handling serial data transfer efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable.

Technical Specifications

Serial Communication Controllers SAFC165H-LF attributes and parameters. Explore more Serial Communication Controllers devices from Infineon Technologies

Specs

Address Bus Width:

23

Bit Size:

16

Boundary Scan:

YES

CPU Family:

80166

Maximum Clock Frequency:

36 MHz

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC

Maximum Data Transfer Rate:

2.25 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

3072

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

SAFC165H-LF Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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