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SC16C754BIB80,528

NXP Semiconductors

SC16C754BIB80,528 by NXP Semiconductors

SC16C754BIB80,528 by NXP Semiconductors is a Serial Communication Controller with 3.63V max supply voltage and 0.625 MBps data transfer rate. Ideal for industrial applications, it features 80 terminals in a low profile flatpack package style. Operating temperature ranges from -40 to 85 °C.

Median Price

$11.434

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 89 parts In-Stock

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Vyrian

USA . 6,226 parts In-Stock

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Anansix

USA . 2,803 parts In-Stock

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Digiode

USA . 1,311 parts In-Stock

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Euro-Tech

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One Stop Electronics

USA . 633 parts In-Stock

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$11.000

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Continental Prestige Electronics

USA . 2,619 parts In-Stock

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$11.205

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Ampacity Inc.

Singapore . 504 parts In-Stock

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AZTECH Wire

Italy . 523 parts In-Stock

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$12.740

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Semicontronic

India . 1,296 parts In-Stock

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$19.000

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$18.525

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$18.430

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Aztec Data Supply Inc.

USA . 1,586 parts In-Stock

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$30.610

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Corohmni

South Africa . 197 parts In-Stock

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Microchip USA

USA . 378 parts In-Stock

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$40.898

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UNI Independent Distributors

Spain . 7,954 parts In-Stock

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Argo Parts USA

USA . 3,534 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Overview

Elevate your communication systems with the SC16C754BIB80,528 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability. This Serial Communication Controller provides seamless integration and high-speed data transfer, making it ideal for a wide range of applications. Experience the value of efficient performance, versatility, and advanced technology with this innovative product. Upgrade your devices today with the SC16C754BIB80,528 and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight yet durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 3.63 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, enhancing its versatility.

Address Bus Width: 3

The address bus width of 3 supports efficient data transmission, optimizing the controller's performance.

Package Shape: SQUARE

The square package shape is space-saving and facilitates easy integration into various electronic systems.

Power Supplies (V): 2.5/5

The dual power supply options of 2.5V and 5V offer flexibility in powering the controller according to system requirements.

No. of Terminals: 80

With a high number of terminals, the controller can accommodate a variety of connections, enhancing its compatibility with different devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for efficient heat dissipation and compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 2.97 V

The low minimum supply voltage ensures the controller can operate efficiently even with lower power sources, improving energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the controller can withstand harsh environmental conditions, increasing its reliability.

Maximum Data Transfer Rate: 0.625 MBps

The high data transfer rate of 0.625 MBps enables fast and efficient communication between devices, enhancing overall system performance.

Technical Specifications

Serial Communication Controllers SC16C754BIB80,528 attributes and parameters. Explore more Serial Communication Controllers devices from NXP Semiconductors

Specs

Additional Features:

ALSO OPERATES AT 2.5V OR 5V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

80 MHz

Communication Protocol:

ASYNC, BIT

Maximum Data Transfer Rate:

.625 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Serial I/Os:

4

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Trade Compliance

SC16C754BIB80,528 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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