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TL16C550CIFN

Texas Instruments

TL16C550CIFN by Texas Instruments

TL16C550CIFN by Texas Instruments is a Serial Communication Controller with 44 terminals, operating at 3.3/5V. It supports data rates up to 0.125 MBps and communication protocols like ASYNC and BIT. Ideal for industrial applications requiring reliable serial IO/communication control at temperatures ranging from -40 to 85°C.

Median Price

$5.350

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 11,493 parts In-Stock

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-

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$4.280

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$3.830

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$3.600

11,493

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$3.600

DigiKey

USA . 11,493 parts In-Stock

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$5.630

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$5.630

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Verical

USA . 5,794 parts In-Stock

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$5.350

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$4.787

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$4.500

5,794

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$4.787

$4.500

Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$4.230

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500

$4.230

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Digiode

USA . 3,306 parts In-Stock

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$4.512

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TEDSS.com

USA . 1,559 parts In-Stock

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$5.000

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$4.240

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DigiKey Marketplace

USA . 11,710 parts In-Stock

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Vyrian

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Chip Stock

USA . 2,934 parts In-Stock

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R&J Components

USA . 1,692 parts In-Stock

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Bristol Electronics

USA . 372 parts In-Stock

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Atlantic Semiconductor

USA . 234 parts In-Stock

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Mentor Electronics Marketing, LLC

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ACDS - Activité Composants Distribution Service

France . 26 parts In-Stock

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Dan-Mar Components

USA . 26 parts In-Stock

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ComSIT Distribution GmbH

Germany . 24 parts In-Stock

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Flex Direct, LLC

USA . 23 parts In-Stock

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Prism Electronics

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Lantek

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Cogito LLC

Ukraine . 6 parts In-Stock

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Cyclops Electronics Ltd

UK . 6 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 9,263 parts In-Stock

1+ parts

$4.040

100+ parts

$3.939

1k+ parts

$3.919

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9,263

$4.040

$3.939

$3.919

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Ampacity Inc.

Singapore . 9,031 parts In-Stock

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$4.040

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$4.040

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Aranea Global

USA . 50 parts In-Stock

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$4.145

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$3.980

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50

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$3.980

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Corphita

USA . 1,727 parts In-Stock

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$4.275

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Parana Technologies

USA . 1,188 parts In-Stock

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$28.186

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$44.669

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DigiPath Technology Company

USA . 762 parts In-Stock

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$31.037

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$28.554

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ChromeModa Solutions

Germany . 1,183 parts In-Stock

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$31.670

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$25.969

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$25.969

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IDEA Electronic Components Group

UK . 1,007 parts In-Stock

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$31.670

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$30.086

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$28.503

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$31.670

$30.086

$28.503

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Corohmni

South Africa . 21 parts In-Stock

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$62.732

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Lixinc

USA . 10,103 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,879 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 3,876 parts In-Stock

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Perfect Parts

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Microchip USA

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Infinite Electronics LLP (Excess)

. 287 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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GreenTree Electronics

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USA . 15 parts In-Stock

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Overview

The TL16C550CIFN by Texas Instruments is a top-of-the-line Serial Communication Controller that offers unmatched quality and reliability. With a focus on innovation and cutting-edge technology, Texas Instruments ensures that their products meet the highest standards in the industry. This versatile chip carrier package is ideal for a wide range of applications, from industrial automation to consumer electronics. Experience seamless data transfer rates and efficient communication protocols with the TL16C550CIFN, providing customers with exceptional value and performance that sets them apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the components inside, making the product resistant to physical damage.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into electronic circuits, saving space and enabling efficient PCB design.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage tolerance provides flexibility and compatibility with different power sources, ensuring stable operation.

Address Bus Width: 3

Address bus width of 3 allows for efficient communication and addressing of different components in a system, enhancing overall performance.

Package Shape: SQUARE

Square package shape is easy to handle and provides uniformity in terms of dimensions for easier PCB layout and mounting.

Power Supplies (V): 3.3/5

Multiple power supply options of 3.3V and 5V enable compatibility with different circuits and devices, offering versatility in application.

No. of Terminals: 44

High number of terminals allows for extensive connectivity options and flexibility in interfacing with other components, making it suitable for complex systems.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides compactness and efficient heat dissipation, making it suitable for applications where space and thermal considerations are important.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures reliable operation even under varying voltage conditions, enhancing the product's robustness.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for operation in harsh environments, ensuring reliability and performance under challenging conditions.

Maximum Data Transfer Rate: 0.125 MBps

High maximum data transfer rate of 0.125 MBps facilitates fast and efficient communication, making the product suitable for applications requiring quick data exchange.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions, ensuring functionality in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent corrosion resistance and ensures a reliable electrical connection over time, increasing product longevity.

Terminal Position: QUAD

Quad terminal position provides stable and secure connections, reducing the risk of intermittent connections and signal loss.

Maximum Seated Height: 4.57 mm

Low maximum seated height allows for a slim profile and compact design, making the product suitable for applications where space constraints are a concern.

Width: 16.585 mm

Moderate width dimension provides a balance between compactness and ease of handling, offering convenience during installation and maintenance.

Data Encoding or Decoding Method: NRZ

NRZ data encoding method simplifies data transmission and reception, improving overall efficiency and reliability of communication.

External Data Bus Width: 8

Wide external data bus width of 8 allows for simultaneous transmission of multiple data bits, enhancing data processing speed and performance.

Communication Protocol: ASYNC, BIT

Support for asynchronous communication protocol and bit-level data transfer provides flexibility and compatibility with various systems, ensuring seamless integration.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency of 16 MHz enables fast data processing and communication speed, making the product suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

Long maximum time at peak reflow temperature of 30 seconds allows for proper soldering and rework processes, ensuring reliable connections and durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and assembly, leading to robust connections and stable performance.

Length: 16.585 mm

Moderate length dimension provides a balance between compactness and ease of connection, offering versatility in various PCB layouts and configurations.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures reliable operation in harsh industrial environments, making the product suitable for rugged applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Peripheral IC type specializing in serial I/O and communication control offers advanced features and functionalities, enhancing the product's capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving energy efficiency and overall system reliability.

Terminal Form: J BEND

J Bend terminal form offers secure and stable connections, reducing the risk of signal interference and ensuring reliable data transmission.

Maximum Supply Current: 10 mA

Low maximum supply current requirement of 10 mA helps in minimizing power consumption and heat generation, contributing to energy efficiency and prolonged product lifespan.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5V ensures consistent and reliable operation, reducing the risk of electrical issues and malfunctions.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27 mm allows for easy PCB layout and soldering, facilitating smooth integration into electronic circuits.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to maintain product performance and reliability.

Technical Specifications

Serial Communication Controllers TL16C550CIFN attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY AT 14.9 MHZ

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

16 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.125 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

TL16C550CIFN Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-606-9743, 5962016069743

NIIN

016069743

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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