Loading...

TL16C552FNRG4

Texas Instruments

TL16C552FNRG4 by Texas Instruments

TL16C552FNRG4 by Texas Instruments is a Serial Communication Controller with 5.5V max supply voltage, 8MHz clock frequency, and 68 terminals. Ideal for IBM PC-AT bus compatibility, it operates in commercial temperature grade range of 0-70°C for serial I/O communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,143 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,143

-

-

-

-

Vyrian

USA . 3,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,927

-

-

-

-

Chip Stock

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,520

-

-

-

-

Euro-Tech

UK . 247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

247

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,085 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,085

$1.000

-

-

-

AZTECH Wire

Italy . 811 parts In-Stock

1+ parts

$15.899

100+ parts

-

1k+ parts

-

10k+ parts

-

811

$15.899

-

-

-

Parana Technologies

USA . 312 parts In-Stock

1+ parts

$32.729

100+ parts

-

1k+ parts

$111.885

10k+ parts

-

312

$32.729

-

$111.885

-

DigiPath Technology Company

USA . 1,333 parts In-Stock

1+ parts

$36.039

100+ parts

-

1k+ parts

-

10k+ parts

-

1,333

$36.039

-

-

-

ChromeModa Solutions

Germany . 4,001 parts In-Stock

1+ parts

$36.774

100+ parts

$30.155

1k+ parts

-

10k+ parts

-

4,001

$36.774

$30.155

-

-

IDEA Electronic Components Group

UK . 1,053 parts In-Stock

1+ parts

$36.774

100+ parts

$34.935

1k+ parts

$33.097

10k+ parts

-

1,053

$36.774

$34.935

$33.097

-

Microchip USA

USA . 1,878 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,878

-

-

-

-

Corphita

USA . 203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

203

-

-

-

-

Overview

Unlock seamless communication and enhanced connectivity with the TL16C552FNRG4 by Texas Instruments. Crafted with precision and expertise, Texas Instruments has a long-standing reputation for delivering top-quality products. As a leading manufacturer of Serial Communication Controllers, this product offers unparalleled reliability and performance. From industrial automation to telecommunications, the TL16C552FNRG4 is versatile and adaptable to a wide range of applications. Experience the exceptional value and benefits that this product brings, providing customers with a seamless and efficient solution for all their communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product suitable for various harsh environments.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of operating voltages, ensuring compatibility with different power sources.

Address Bus Width: 3

Allows for efficient communication between different devices or components within the system.

Package Shape: SQUARE

Helps in optimizing the use of space on the circuit board and enhances the overall aesthetics of the product.

No. of Terminals: 68

Provides multiple connection points for various external devices, enabling versatile functionality and connectivity.

Package Style (Meter): CHIP CARRIER

Enhances thermal performance and reliability due to its low-profile design and efficient heat dissipation capabilities.

Minimum Supply Voltage: 4.5 V

Ensures stable operation even under low voltage conditions, improving the product's reliability and performance.

Maximum Operating Temperature: 70 °C

Allows for operation in a wide range of temperature environments, making the product suitable for diverse applications.

Minimum Operating Temperature: 0 °C

Ensures proper functionality even in low-temperature conditions, increasing the product's versatility and usability.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: QUAD

Facilitates easy installation and maintenance of the product, improving overall user experience.

Maximum Seated Height: 4.57 mm

Compact design and low seated height make the product suitable for space-constrained applications.

Width: 24.23 mm

Optimal width dimension for incorporating into various circuit board layouts, enabling efficient space utilization.

External Data Bus Width: 8

High data bus width allows for fast and efficient data transfer between the product and external devices.

Communication Protocol: ASYNC, BIT

Supports versatile communication protocols, enabling compatibility with a wide range of systems and devices.

Maximum Clock Frequency: 8 MHz

High clock frequency allows for fast data processing and communication speeds, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and component bonding during assembly processes, improving product reliability.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes, ensuring proper connections and component integrity.

Length: 24.23 mm

Optimal length dimension for integration into various circuit board designs, enhancing flexibility in product applications.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where standard temperature ranges are required for reliable operation.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specifically designed for serial communication tasks, ensuring efficient and reliable data transfer between devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing energy efficiency and performance.

Terminal Form: J BEND

J bend terminals facilitate easy and secure connections during installation, improving overall product reliability.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with a wide range of power sources and systems.

No. of Serial I/Os: 2

Multiple serial I/O ports provide versatility in connecting and communicating with external devices, enhancing product functionality.

Bus Compatibility: IBM PC-AT

Designed to be compatible with IBM PC-AT bus systems, ensuring easy integration and interoperability with existing platforms.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration with standard PCB designs, facilitating efficient assembly processes.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity during soldering processes, requiring proper handling and storage procedures.

Technical Specifications

Serial Communication Controllers TL16C552FNRG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

DIMENSION CONSIDERED BASED ON LINK HTTP://WWW.TI.COM/LIT/ML/MPQC016/MPQC016.PDF

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552FNRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20