Loading...

TL16C552FNG4

Texas Instruments

TL16C552FNG4 by Texas Instruments

TL16C552FNG4 by Texas Instruments is a Serial Communication Controller with 8-bit External Data Bus Width, operating at up to 8 MHz clock frequency. It is used in IBM PC-AT compatible systems for asynchronous communication protocols. The chip carrier package has 68 terminals and operates within a temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,093 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,093

-

-

-

-

Digiode

USA . 2,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,530

-

-

-

-

Chip Stock

USA . 2,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,510

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 848 parts In-Stock

1+ parts

$6.042

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$6.042

-

-

-

One Stop Electronics

USA . 1,265 parts In-Stock

1+ parts

$13.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,265

$13.000

-

-

-

Parana Technologies

USA . 1,457 parts In-Stock

1+ parts

$66.088

100+ parts

-

1k+ parts

-

10k+ parts

-

1,457

$66.088

-

-

-

DigiPath Technology Company

USA . 662 parts In-Stock

1+ parts

$72.771

100+ parts

$66.949

1k+ parts

-

10k+ parts

-

662

$72.771

$66.949

-

-

IDEA Electronic Components Group

UK . 1,254 parts In-Stock

1+ parts

$74.256

100+ parts

$70.543

1k+ parts

$66.830

10k+ parts

-

1,254

$74.256

$70.543

$66.830

-

ChromeModa Solutions

Germany . 1,186 parts In-Stock

1+ parts

$74.256

100+ parts

$60.890

1k+ parts

-

10k+ parts

-

1,186

$74.256

$60.890

-

-

Microchip USA

USA . 2,915 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,915

-

-

-

-

Corphita

USA . 495 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

495

-

-

-

-

Overview

Unlock seamless serial communication with the Texas Instruments TL16C552FNG4. Trusted by industry leaders, this Serial Communication Controller offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides unmatched value, efficiency, and flexibility to customers. Experience smooth data transmission and enhance your projects with the TL16C552FNG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration into compact designs and PCB layouts.

Maximum Supply Voltage: 5.25 V

Can operate efficiently within a standard voltage range, ensuring compatibility with various power sources.

Address Bus Width: 3

Having a wider address bus width allows for efficient data handling and processing.

Package Shape: SQUARE

Square package shape ensures easier handling and placement during assembly.

No. of Terminals: 68

Having a higher number of terminals offers more connectivity options and flexibility in interfacing with other components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides a compact form factor ideal for space-constrained applications.

Minimum Supply Voltage: 4.75 V

Can operate at a low supply voltage, which can be beneficial for energy efficiency and battery-powered devices.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal positioning facilitates easier soldering and PCB mounting.

Maximum Seated Height: 4.57 mm

Low seated height allows for a more compact overall system design.

Width: 24.23 mm

Compact width dimension enables space-saving integration in electronic devices.

External Data Bus Width: 8

A wider external data bus allows for faster data transmission and processing.

Communication Protocol: ASYNC, BIT

Supports asynchronous communication protocol, which is commonly used in serial data transmission.

Maximum Clock Frequency: 8 MHz

High clock frequency enables rapid data transfer rates for efficient performance.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow temperature and time ensure proper soldering and component reliability.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly processes without degradation.

Length: 24.23 mm

Compact length dimension contributes to a space-efficient product design.

Temperature Grade: COMMERCIAL

Designed for standard commercial operating temperature ranges.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Specifically designed for serial input/output communication tasks, ensuring optimal performance.

Technology: CMOS

Utilizes CMOS technology known for its low power consumption and high noise immunity.

Terminal Form: J BEND

J-bend terminal form offers mechanical stability and ease of soldering.

Maximum Supply Current: 50 mA

Operates within a moderate supply current range, suitable for various power sources.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation.

No. of Serial I/Os: 2

Two serial I/O ports provide flexibility in data communication and interfacing with external devices.

Bus Compatibility: IBM PC-AT

Compatible with IBM PC-AT bus standards, ensuring broad compatibility with existing systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy PCB layout and assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly.

No. of I/O Lines: 8

Eight I/O lines provide ample connectivity options for interfacing with external peripherals and devices.

Technical Specifications

Serial Communication Controllers TL16C552FNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

DIMENSION CONSIDERED BASED ON LINK HTTP://WWW.TI.COM/LIT/ML/MPQC016/MPQC016.PDF

Address Bus Width:

3

Boundary Scan:

NO

Bus Compatibility:

IBM PC-AT

Maximum Clock Frequency:

8 MHz

Communication Protocol:

ASYNC, BIT

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

8

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C552FNG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20