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LAN9252TI/ML

Microchip Technology

LAN9252TI/ML by Microchip Technology

LAN9252TI/ML by Microchip Technology is a Serial Communication Controller with 16-bit Address Bus, 12.5 MBps Data Transfer Rate, and SYNC/BYTE Ethernet Protocol support. It operates b/w -40 to 85 °C, suitable for low power applications in automotive and industrial sectors. The chip carrier package has 64 terminals with a 0.5 mm pitch.

Median Price

$10.660

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,785 parts In-Stock

1+ parts

$10.660

100+ parts

$8.575

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-

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$8.575

1,785

$10.660

$8.575

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$8.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 98 parts In-Stock

1+ parts

$11.761

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-

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98

$11.761

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Vyrian

USA . 7,056 parts In-Stock

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7,056

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Distributors (Availability)

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Semicontronic

India . 4,203 parts In-Stock

1+ parts

$10.960

100+ parts

$10.686

1k+ parts

$10.631

10k+ parts

-

4,203

$10.960

$10.686

$10.631

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Netroflash

USA . 100 parts In-Stock

1+ parts

$11.761

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100

$11.761

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Corohmni

South Africa . 116 parts In-Stock

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$12.465

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116

$12.465

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$12.811

100+ parts

$11.658

1k+ parts

$10.505

10k+ parts

-

200

$12.811

$11.658

$10.505

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AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$15.382

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706

$15.382

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Aztec Data Supply Inc.

USA . 4,770 parts In-Stock

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$83.690

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4,770

$83.690

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Lixinc

USA . 12,537 parts In-Stock

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LMD Electronica

Estonia . 5,917 parts In-Stock

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Montano Global Distributors

Canada . 5,816 parts In-Stock

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Continental Prestige Electronics

USA . 5,806 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,249 parts In-Stock

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NIA Electronics

USA . 2,869 parts In-Stock

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Ledger Components

France . 2,869 parts In-Stock

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Argo Parts USA

USA . 1,394 parts In-Stock

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1,394

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Overview

Unlock seamless and reliable serial communication with the LAN9252TI/ML by Microchip Technology. With a commitment to quality and innovation, Microchip delivers top-notch Serial Communication Controllers that cater to a wide range of applications. This product guarantees high performance and efficiency, allowing customers to experience enhanced data transfer rates of up to 12.5 MBps. Say goodbye to connectivity issues and hello to a smoother operation with the LAN9252TI/ML.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and secure installation on PCBs, saving valuable space and ensuring durability.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a safe voltage range, minimizing the risk of damage due to overvoltage.

Address Bus Width: 16

Wide address bus width enables efficient communication with other components within the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style ensures effective heat dissipation, compact size, and compatibility with modern PCB designs.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate allows for quick and reliable communication, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

High clock frequency enables rapid processing speeds, making the product suitable for demanding applications.

Communication Protocol: SYNC, BYTE; ETHERNET

Supports multiple communication protocols, offering flexibility and compatibility with various systems and networks.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Integrated peripheral IC type ensures seamless connectivity and communication capabilities for networked devices.

Low Power Mode: YES

Low power mode helps conserve energy and prolong battery life, making the product an efficient and environmentally friendly choice.

Technical Specifications

Serial Communication Controllers LAN9252TI/ML attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

16

Boundary Scan:

YES

Bus Compatibility:

I2C, SPI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

SYNC, BYTE; ETHERNET

Data Encoding or Decoding Method:

NRZI

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

16

JESD-30 Code:

S-XQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of Serial I/Os:

4

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

LAN9252TI/ML Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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