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DP83816AVNG-EX/NOPB

Texas Instruments

DP83816AVNG-EX/NOPB by Texas Instruments

DP83816AVNG-EX/NOPB by Texas Instruments is a Serial Communication Controller with 32-bit address bus width and 12.5 MBps data transfer rate. It is used in LAN applications, supporting communication protocols like ASYNC, BIT and SYNC, BYTE. The package style is flatpack with low profile and fine pitch, making it suitable for PCI bus compatibility.

Median Price

$10.210

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 200 parts In-Stock

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$9.859

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Flip Electronics

USA . 49 parts In-Stock

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$10.210

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Bristol Electronics

USA . 47 parts In-Stock

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Vyrian

USA . 1,100 parts In-Stock

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Digiode

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Anansix

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Elcom Components

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Distributors (Availability)

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AZTECH Wire

Italy . 598 parts In-Stock

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$5.049

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Semicontronic

India . 561 parts In-Stock

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$7.000

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$6.825

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$6.790

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Modulus Dynamics

Lithuania . 52 parts In-Stock

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$9.119

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$9.027

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$8.754

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Continental Prestige Electronics

USA . 1,595 parts In-Stock

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$9.260

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$9.075

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$22.390

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$21.271

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$21.271

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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$26.000

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One Stop Electronics

USA . 222 parts In-Stock

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$28.000

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Corohmni

South Africa . 688 parts In-Stock

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Parana Technologies

USA . 341 parts In-Stock

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IDEA Electronic Components Group

UK . 1,631 parts In-Stock

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$75.182

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$71.423

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$67.664

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ChromeModa Solutions

Germany . 967 parts In-Stock

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$75.182

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$61.649

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Component Stockers USA

USA . 615 parts In-Stock

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$99.990

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Argo Parts USA

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Authorized Procurement Solutions

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Glotronic Ltd.

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DigiPath Technology Company

USA . 2,276 parts In-Stock

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Microchip USA

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Corphita

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Perfect Parts

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Robosynatics

Brazil . 10 parts In-Stock

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Lucentia Tech

USA . 10 parts In-Stock

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$2.548

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Overview

Unlock seamless communication and connectivity with the Texas Instruments DP83816AVNG-EX/NOPB. Designed by a trusted manufacturer, this Serial Communication Controller offers unparalleled reliability and performance. Ideal for various applications including Ethernet and LAN, this product ensures efficient data transfer rates of up to 12.5 MBps. With low power mode capabilities and a wide supply voltage range, customers can enjoy superior functionality while maximizing energy efficiency. Upgrade your systems today with the DP83816AVNG-EX/NOPB and experience the difference in quality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage provides flexibility in power source options.

Address Bus Width: 32

32-bit address bus width allows for efficient data processing and storage.

Package Shape: SQUARE

Square shape design helps in optimizing space on a circuit board.

No. of Terminals: 144

More terminals allow for multiple connections and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch style enhances the product's compactness and performance.

Minimum Supply Voltage: 3 V

Low minimum supply voltage conserves power consumption.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability in various environments.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate enables quick and efficient communication.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures product functionality in cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and solderability to the terminals.

Terminal Position: QUAD

Quad terminal positioning allows for stable connections and improved signal transmission.

Maximum Seated Height: 1.6 mm

Low maximum seated height contributes to the product's slim profile.

Width: 20 mm

20mm width makes the product suitable for compact designs.

Data Encoding or Decoding Method: NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Multiple encoding options offer flexibility in data transmission protocols.

External Data Bus Width: 32

32-bit external data bus width supports high-speed and high-volume data transfer.

Communication Protocol: ASYNC, BIT; SYNC, BYTE; ETHERNET

Versatile communication protocols enable compatibility with various systems.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature guarantees secure solder joints.

Length: 20 mm

20mm length enhances the product's versatility in different applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Designed as a serial I/O and communication controller with LAN capabilities for diverse connectivity options.

Technology: CMOS

CMOS technology provides low power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminal form offers secure connections and easy soldering.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent operation.

No. of Serial I/Os: 7

Seven serial I/Os enable multiple communication channels.

Bus Compatibility: PCI

PCI bus compatibility allows for integration into a variety of systems.

Terminal Pitch: 0.5 mm

Fine 0.5mm terminal pitch facilitates compact layout designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 protection ensures reliability in humid environments.

Low Power Mode: YES

Low power mode option helps in energy conservation and efficiency.

Technical Specifications

Serial Communication Controllers DP83816AVNG-EX/NOPB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Communication Protocol:

ASYNC, BIT; SYNC, BYTE; ETHERNET

Data Encoding or Decoding Method:

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

7

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Trade Compliance

DP83816AVNG-EX/NOPB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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