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DP83902AV

Texas Instruments

DP83902AV by Texas Instruments

DP83902AV by Texas Instruments is a Serial Communication Controller with 16-bit Address Bus, 1.25 MBps Data Transfer Rate, and 20 MHz Clock Frequency. It is used in LAN applications for high-speed data encoding/decoding using NRZ and Manchester methods at temperatures ranging from 0 to 70°C.

Median Price

$52.410

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$52.410

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Vyrian

USA . 3,657 parts In-Stock

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Digiode

USA . 3,330 parts In-Stock

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Anansix

USA . 2,460 parts In-Stock

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Q Components

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J & M Industries LLC

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LWI Electronics Inc

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ComSIT Distribution GmbH

Germany . 38 parts In-Stock

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Electronic Expediters

USA . 27 parts In-Stock

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Prism Electronics

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Electro Mavin

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Sunrise Surplus Inc.

USA . 8 parts In-Stock

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MRC Electronics

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Mil-Aero Solutions, Inc.

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Native Components

USA . 560 parts In-Stock

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$1.078

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Northwest PG Solutions

USA . 1,623 parts In-Stock

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$1.186

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AZTECH Wire

Italy . 218 parts In-Stock

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$11.864

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One Stop Electronics

USA . 697 parts In-Stock

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Parana Technologies

USA . 1,607 parts In-Stock

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$27.291

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$34.236

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ChromeModa Solutions

Germany . 6,160 parts In-Stock

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$30.664

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$25.144

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IDEA Electronic Components Group

UK . 358 parts In-Stock

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$30.664

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$29.131

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$27.598

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Lixinc

USA . 18,501 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,104 parts In-Stock

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Corphita

USA . 2,616 parts In-Stock

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DigiPath Technology Company

USA . 1,358 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 359 parts In-Stock

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Glotronic Ltd.

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Kepictronics

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Overview

Enhance your communication systems with the Texas Instruments DP83902AV Serial Communication Controller. Manufactured with top quality materials and cutting-edge technology, this chip carrier package offers unrivaled performance and reliability. Ideal for LAN applications, this controller ensures seamless data transfer at speeds of up to 1.25 MBps. Upgrade your systems today with the DP83902AV and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into compact circuit designs.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power requirements.

Address Bus Width: 16

With a wide address bus width of 16, this product can handle large amounts of data efficiently.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and ideal for space-constrained applications.

Maximum Data Transfer Rate: 1.25 MBps

The high data transfer rate of 1.25 MBps enables fast and efficient communication.

Maximum Clock Frequency: 20 MHz

With a high maximum clock frequency of 20 MHz, this product can operate at high speeds.

Technical Specifications

Serial Communication Controllers DP83902AV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

Data Encoding or Decoding Method:

NRZ; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J84

Length:

29.31 mm

Low Power Mode:

NO

No. of Serial I/Os:

1

No. of Terminals:

84

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

29.31 mm

Trade Compliance

DP83902AV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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