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DP83901AV

Texas Instruments

DP83901AV by Texas Instruments

DP83901AV by Texas Instruments is a Serial Communication Controller with 16-bit address bus width, 1.25 MBps data transfer rate, and 20 MHz clock frequency. It is used in LAN applications for high-speed data encoding/decoding using NRZ and Manchester methods at temperatures ranging from 0 to 70°C.

Median Price

$11.680

Lifecycle Status

Suppliers In-Stock

32

In-Stock Inventory

1k+

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Rochester

USA . 33 parts In-Stock

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$10.840

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$9.700

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$9.130

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DigiKey

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Freelance Electronics

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$6.846

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DF Sales Co.

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Digiode

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Bristol Electronics

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MRC Electronics

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Manoshevitz Elec. Sales

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DigiKey Marketplace

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Electro Mavin

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PC Components Company LLC

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Native Components

USA . 352 parts In-Stock

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$1.085

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Northwest PG Solutions

USA . 1,633 parts In-Stock

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$1.193

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Ampacity Inc.

Singapore . 33 parts In-Stock

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$10.230

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Corphita

USA . 1,345 parts In-Stock

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Component Stockers USA

USA . 35 parts In-Stock

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$12.260

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Parana Technologies

USA . 1,242 parts In-Stock

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DigiPath Technology Company

USA . 2,342 parts In-Stock

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$79.693

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$73.317

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ChromeModa Solutions

Germany . 5,153 parts In-Stock

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$66.682

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IDEA Electronic Components Group

UK . 89 parts In-Stock

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$77.253

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$73.187

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Alle Elektronik GmbH

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Microchip USA

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Overview

Unlock the power of seamless communication with the Texas Instruments DP83901AV Serial Communication Controller. Designed to deliver top-notch performance and reliability, this innovative device is perfect for a wide range of applications. With Texas Instruments' reputation for quality and excellence, you can trust that this product will exceed your expectations. Experience the value and benefits that this controller brings to your projects, providing fast data transfer rates and reliable connectivity. Embrace the future of technology with the DP83901AV by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25 V provides flexibility in power input and ensures reliable operation within the specified voltage range.

Address Bus Width: 16

The wide address bus width of 16 supports efficient communication and data processing, enhancing the performance of the controller.

Package Shape: SQUARE

The square package shape offers a compact design that facilitates easy integration into existing systems or circuit layouts.

No. of Terminals: 68

With 68 terminals, this controller offers multiple connection points for various input/output functions, enabling versatile use in different applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal performance and reliability, ensuring stable operation even under demanding conditions.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75 V optimizes power efficiency while maintaining proper functionality, making it suitable for power-sensitive applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the controller to operate reliably in various environments with elevated temperatures.

Maximum Data Transfer Rate: 1.25 MBps

The high data transfer rate of 1.25 MBps enables fast and efficient communication between devices, enhancing overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the controller can function effectively in cold climates or refrigerated conditions.

Terminal Position: QUAD

The quad terminal position facilitates secure and stable connections, reducing the risk of signal loss or interference for reliable data transmission.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm allows for a compact overall design, ideal for space-constrained applications or devices.

Width: 25.13 mm

The moderate width of 25.13 mm provides a balance between compactness and ease of handling during installation and maintenance.

Data Encoding or Decoding Method: NRZ; BIPH-LEVEL(MANCHESTER)

The use of NRZ and BIPH-LEVEL (Manchester) encoding/decoding methods ensures accurate and reliable data transmission, reducing errors and enhancing communication efficiency.

External Data Bus Width: 16

The wide external data bus width of 16 supports high-speed data transfer and processing, improving overall system performance and responsiveness.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency of 20 MHz enables fast data processing and communication, making the controller suitable for high-speed applications or real-time operations.

Length: 25.13 mm

The moderate length of 25.13 mm contributes to a compact form factor, allowing for easy integration into various system layouts or designs.

Temperature Grade: COMMERCIAL

The commercial-grade temperature rating ensures reliable operation within standard environmental conditions, making the controller suitable for commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The inclusion of a serial IO/communication controller and LAN peripheral IC offers versatile connectivity options and communication capabilities, expanding the controller's functionality.

Technology: CMOS

The CMOS technology used in the controller provides low power consumption, high noise immunity, and compatibility with a wide range of devices, enhancing overall performance and reliability.

Terminal Form: J BEND

The J bend terminal form offers secure connections and easy soldering, ensuring stable signal transmission and robust electrical connections.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying integration and operation in various systems or applications.

No. of Serial I/Os: 2

Having 2 serial I/Os allows for multiple simultaneous communication channels, enabling more efficient data transfer and device connectivity.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm enables compact PCB layout designs and helps reduce signal crosstalk or interference, ensuring reliable data transmission.

Technical Specifications

Serial Communication Controllers DP83901AV attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

NO

Maximum Clock Frequency:

20 MHz

Data Encoding or Decoding Method:

NRZ; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

1.25 MBps

External Data Bus Width:

16

JESD-30 Code:

S-PQCC-J68

Length:

25.13 mm

Low Power Mode:

NO

No. of Serial I/Os:

2

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

25.13 mm

Trade Compliance

DP83901AV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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