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DP83816AVNG/NOPB

Texas Instruments

DP83816AVNG/NOPB by Texas Instruments

DP83816AVNG/NOPB by Texas Instruments is a Serial Communication Controller with 32-bit address bus, 12.5 MBps data transfer rate, and Ethernet communication protocol. It operates at 3.3V with low power mode, suitable for LAN applications in commercial temperature grade environments.

Median Price

$10.137

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 50 parts In-Stock

1+ parts

$7.100

100+ parts

$5.080

1k+ parts

$4.150

10k+ parts

-

50

$7.100

$5.080

$4.150

-

DigiKey

USA . 380 parts In-Stock

1+ parts

$16.130

100+ parts

$11.325

1k+ parts

$10.299

10k+ parts

-

380

$16.130

$11.325

$10.299

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Mouser Electronics

USA . 103 parts In-Stock

1+ parts

$16.130

100+ parts

$11.330

1k+ parts

$10.290

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103

$16.130

$11.330

$10.290

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Rochester

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$8.110

1k+ parts

$7.260

10k+ parts

$6.830

300

-

$8.110

$7.260

$6.830

Verical

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$10.137

1k+ parts

$9.075

10k+ parts

$8.537

300

-

$10.137

$9.075

$8.537

Distributors (In-Stock)

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Digiode

USA . 1,468 parts In-Stock

1+ parts

$7.438

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1,468

$7.438

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Chip Stock

USA . 13,714 parts In-Stock

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Vyrian

USA . 5,516 parts In-Stock

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Anansix

USA . 2,193 parts In-Stock

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2,193

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Rebound Electronics

UK . 520 parts In-Stock

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520

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Inventory MP

USA . 109 parts In-Stock

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Bristol Electronics

USA . 109 parts In-Stock

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Quantum Digital Technology

USA . 106 parts In-Stock

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Component Sense

UK . 92 parts In-Stock

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Semtec, LLC

USA . 50 parts In-Stock

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50

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ACDS - Activité Composants Distribution Service

France . 30 parts In-Stock

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30

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Holdelec - ElecDif-Pro

France . 30 parts In-Stock

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30

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Speed Components Ltd

Israel . 21 parts In-Stock

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Flex Direct, LLC

USA . 10 parts In-Stock

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10

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Connect4Technologies Inc.

Canada . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,392 parts In-Stock

1+ parts

$7.047

100+ parts

-

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1,392

$7.047

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Parana Technologies

USA . 393 parts In-Stock

1+ parts

$33.246

100+ parts

$3,087.391

1k+ parts

$29.921

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393

$33.246

$3,087.391

$29.921

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Microchip USA

USA . 2,972 parts In-Stock

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$34.160

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$34.160

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DigiPath Technology Company

USA . 2,152 parts In-Stock

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$36.608

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$36.608

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ChromeModa Solutions

Germany . 3,044 parts In-Stock

1+ parts

$37.355

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$30.631

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3,044

$37.355

$30.631

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IDEA Electronic Components Group

UK . 1,513 parts In-Stock

1+ parts

$37.355

100+ parts

$35.487

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$33.620

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1,513

$37.355

$35.487

$33.620

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Authorized Procurement Solutions

USA . 36,000 parts In-Stock

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Lixinc

USA . 10,371 parts In-Stock

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Kepictronics

USA . 8,953 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,278 parts In-Stock

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Perfect Parts

USA . 6,378 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,852 parts In-Stock

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Northwest PG Solutions

USA . 927 parts In-Stock

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Native Components

USA . 372 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 289 parts In-Stock

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Glotronic Ltd.

UK . 44 parts In-Stock

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Overview

Unlock seamless communication with the DP83816AVNG/NOPB by Texas Instruments. Crafted with precision and excellence, this serial communication controller offers unparalleled reliability and performance for a wide range of applications. From Ethernet protocols to data encoding methods, this product ensures fast and secure data transfer at a maximum rate of 12.5 MBps. With a low power mode and commercial-grade temperature tolerance, customers can trust in the value and benefits this technology brings to their projects. Say goodbye to communication barriers and hello to a world of endless possibilities with the DP83816AVNG/NOPB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and improving manufacturability.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power requirements.

Address Bus Width: 32

Wide address bus width enables communication with multiple devices and enhances data transfer efficiency.

Package Shape: SQUARE

Square package shape helps in efficient utilization of board space and easy alignment during assembly.

Power Supplies (V): 3.3

Stable power supply voltage ensures reliable operation of the communication controller.

No. of Terminals: 144

Ample number of terminals allow for connections to various peripherals and interfaces, enhancing connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, fine pitch package style enhances thermal performance and facilitates high-density mounting on PCBs.

Minimum Supply Voltage: 3 V

Supports low supply voltage requirements while maintaining optimal performance, suitable for energy-efficient applications.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable operation in varying environmental conditions.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate facilitates fast and efficient communication between devices, improving system performance.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures reliable performance even in cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and solderability, ensuring long-term reliability of connections.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections on the PCB, reducing the risk of disconnections.

Maximum Seated Height: 1.6 mm

Low seated height minimizes the overall profile of the device, making it suitable for compact and slim designs.

Width: 20 mm

Compact width dimension enables space-saving integration in limited board space environments.

Data Encoding or Decoding Method: NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Support for multiple data encoding/decoding methods enhances compatibility with different communication protocols and devices.

External Data Bus Width: 32

Wide external data bus width enables seamless data transfer between the communication controller and external devices.

Communication Protocol: ETHERNET

Support for Ethernet communication protocol allows for high-speed data transfer over networks, suitable for various applications.

Maximum Clock Frequency: 25 MHz

High clock frequency ensures efficient data processing and communication, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable soldering and secure mounting on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and robust connection to the PCB, improving durability.

Length: 20 mm

Compact length dimension enables space-efficient integration in electronic designs with size constraints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard environmental conditions, suitable for various commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

Specific peripheral IC type supports serial communication and LAN connectivity, enabling versatile and high-performance data exchange.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ensuring efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure attachment to the PCB, enhancing assembly efficiency.

Maximum Supply Current: 140 mA

Low maximum supply current consumption minimizes power requirements and improves energy efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Bus Compatibility: PCI

PCI bus compatibility allows for easy integration into PCI-based systems, enhancing versatility and compatibility.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and space-saving design, suitable for compact electronic applications.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage practices.

Low Power Mode: YES

Ability to operate in low power mode enhances energy efficiency and prolongs battery life in portable electronic devices.

Technical Specifications

Serial Communication Controllers DP83816AVNG/NOPB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

ETHERNET

Data Encoding or Decoding Method:

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Trade Compliance

DP83816AVNG/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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