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DP83843BVJE/NOPB

Texas Instruments

DP83843BVJE/NOPB by Texas Instruments

DP83843BVJE/NOPB by Texas Instruments is a Serial Communication Controller with 80 terminals, supporting data rates up to 12.5 MBps. It operates b/w 0-70°C and is ideal for Ethernet applications due to IEEE802.3U compatibility and CMOS technology.

Median Price

$21.090

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 8 parts In-Stock

1+ parts

$17.500

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-

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8

$17.500

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Texas Instruments

USA . 11,222 parts In-Stock

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$18.982

100+ parts

$16.581

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$11.435

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-

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$18.982

$16.581

$11.435

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$25.400

100+ parts

$15.700

1k+ parts

$14.900

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30

$25.400

$15.700

$14.900

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Mouser Electronics

USA . 23 parts In-Stock

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$27.100

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23

$27.100

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Element14

Singapore . 4 parts In-Stock

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$33.140

100+ parts

$32.440

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4

$33.140

$32.440

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Rochester

USA . 6,928 parts In-Stock

1+ parts

-

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$16.440

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$14.710

10k+ parts

$13.840

6,928

-

$16.440

$14.710

$13.840

DigiKey

USA . 6,928 parts In-Stock

1+ parts

-

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$21.630

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6,928

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$21.630

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Verical

USA . 2,620 parts In-Stock

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-

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$20.550

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$18.387

10k+ parts

$17.300

2,620

-

$20.550

$18.387

$17.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,270 parts In-Stock

1+ parts

$12.825

100+ parts

-

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1,270

$12.825

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Vyrian

USA . 558 parts In-Stock

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$13.500

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558

$13.500

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DigiKey Marketplace

USA . 6,923 parts In-Stock

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6,923

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Anansix

USA . 1,890 parts In-Stock

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1,890

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Executive Electronics, Inc.

USA . 364 parts In-Stock

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364

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Ashlea Components Ltd

UK . 89 parts In-Stock

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89

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Goldney Electronics S.L.

Spain . 5 parts In-Stock

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Speed Components Ltd

Israel . 3 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 91 parts In-Stock

1+ parts

$1.780

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91

$1.780

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Northwest PG Solutions

USA . 1,378 parts In-Stock

1+ parts

$1.958

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1,378

$1.958

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Corphita

USA . 2,440 parts In-Stock

1+ parts

$12.150

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2,440

$12.150

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Continental Prestige Electronics

USA . 10 parts In-Stock

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$19.350

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10

$19.350

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Parana Technologies

USA . 973 parts In-Stock

1+ parts

$22.957

100+ parts

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$23.609

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973

$22.957

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$23.609

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ChromeModa Solutions

Germany . 4,815 parts In-Stock

1+ parts

$25.794

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$21.151

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4,815

$25.794

$21.151

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IDEA Electronic Components Group

UK . 1,130 parts In-Stock

1+ parts

$25.794

100+ parts

$24.504

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$23.215

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1,130

$25.794

$24.504

$23.215

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Microchip USA

USA . 5,555 parts In-Stock

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$52.279

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5,555

$52.279

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Authorized Procurement Solutions

USA . 35,000 parts In-Stock

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35,000

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Lixinc

USA . 3,874 parts In-Stock

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3,874

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Perfect Parts

USA . 3,839 parts In-Stock

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3,839

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Alle Elektronik GmbH

Germany . 3,489 parts In-Stock

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3,489

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DigiPath Technology Company

USA . 2,031 parts In-Stock

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$23.256

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2,031

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$23.256

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Overview

Enhance your communication systems with the DP83843BVJE/NOPB by Texas Instruments, a top-tier manufacturer renowned for its cutting-edge technology. As a leader in the Serial Communication Controllers category, this product offers unparalleled quality and reliability. From Ethernet applications to LAN networks, this versatile controller ensures seamless data transfer at high speeds of up to 12.5 MBps. With a wide temperature range and low power consumption, customers can trust in the value and performance that this product delivers. Upgrade your systems today and experience the benefits of Texas Instruments' advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation and resistance to heat, making the product durable and reliable.

Surface Mount: YES

Surface mount technology allows for efficient assembly and saves space on the PCB, making the product suitable for compact designs.

Maximum Supply Voltage: 5.25 V

Supports a high supply voltage range, providing flexibility in power options for the device.

Package Shape: SQUARE

Square shape packages are easy to handle and provide a uniform footprint for consistent PCB layout.

Maximum Data Transfer Rate: 12.5 MBps

High data transfer rate ensures fast and efficient communication, ideal for applications requiring real-time data processing.

Communication Protocol: IEEE802.3U; ETHERNET

Supports industry-standard communication protocols, ensuring compatibility and interoperability with a wide range of devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable operation of the product.

Technical Specifications

Serial Communication Controllers DP83843BVJE/NOPB attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Boundary Scan:

NO

Bus Compatibility:

ETHERNET

Communication Protocol:

IEEE802.3U; ETHERNET

Data Encoding or Decoding Method:

NRZ; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

DP83843BVJE/NOPB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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