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DP83816AVNG

Texas Instruments

DP83816AVNG by Texas Instruments

DP83816AVNG by Texas Instruments is a Serial Communication Controller with 32-bit Address Bus, 3.3V Power Supply, and 12.5 MBps Data Transfer Rate. It is used in LAN communication protocols for Ethernet applications requiring low power consumption and PCI bus compatibility.

Median Price

$12.338

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,820 parts In-Stock

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-

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$9.870

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$8.830

10k+ parts

$8.310

2,820

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$9.870

$8.830

$8.310

Verical

USA . 2,820 parts In-Stock

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-

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$12.338

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$11.037

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$10.387

2,820

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$12.338

$11.037

$10.387

DigiKey

USA . 276 parts In-Stock

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$12.990

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$12.990

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Distributors (In-Stock)

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DF Sales Co.

USA . 132 parts In-Stock

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$6.840

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132

$6.840

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DF Sales Co.

USA . 132 parts In-Stock

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$6.840

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$6.840

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Digiode

USA . 2,571 parts In-Stock

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$8.930

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Nova Conductors

Japan . 72 parts In-Stock

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$10.390

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$10.390

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Chip Stock

USA . 9,500 parts In-Stock

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9,500

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Vyrian

USA . 2,373 parts In-Stock

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2,373

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Semi Source

USA . 1,647 parts In-Stock

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1,647

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Anansix

USA . 1,477 parts In-Stock

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J & M Industries LLC

USA . 1,271 parts In-Stock

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Legend Electronics Inc.

USA . 503 parts In-Stock

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503

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Pegasus Components GmbH

Germany . 262 parts In-Stock

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Connector Distribution Corp

USA . 235 parts In-Stock

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235

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Right Parts Inc.

USA . 235 parts In-Stock

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235

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Microfarads

USA . 219 parts In-Stock

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ComSIT Distribution GmbH

Germany . 189 parts In-Stock

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189

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Prism Electronics

USA . 119 parts In-Stock

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119

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Bristol Electronics

USA . 119 parts In-Stock

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119

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Inventory MP

USA . 117 parts In-Stock

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117

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ACDS - Activité Composants Distribution Service

France . 84 parts In-Stock

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84

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Manoshevitz Elec. Sales

Israel . 36 parts In-Stock

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36

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Cyclops Electronics Ltd

UK . 36 parts In-Stock

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CirComp Electronics, Inc.

USA . 35 parts In-Stock

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Zilex Electronics Inc.

Canada . 23 parts In-Stock

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Sea View Technologies

USA . 4 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,843 parts In-Stock

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$7.990

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1,843

$7.990

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Corphita

USA . 4,258 parts In-Stock

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$8.460

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Netroflash

USA . 100 parts In-Stock

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$10.390

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$9.871

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$9.663

100

$10.390

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$9.663

Corohmni

South Africa . 686 parts In-Stock

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$11.690

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686

$11.690

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Microchip USA

USA . 117 parts In-Stock

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$27.380

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$26.990

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$26.800

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$26.600

117

$27.380

$26.990

$26.800

$26.600

Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$29.908

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$64.603

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2,315

$29.908

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$64.603

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DigiPath Technology Company

USA . 1,376 parts In-Stock

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$32.933

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1,376

$32.933

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ChromeModa Solutions

Germany . 3,856 parts In-Stock

1+ parts

$33.605

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$27.556

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3,856

$33.605

$27.556

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IDEA Electronic Components Group

UK . 918 parts In-Stock

1+ parts

$33.605

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$31.925

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$30.244

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918

$33.605

$31.925

$30.244

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$55.973

100+ parts

$50.935

1k+ parts

$45.898

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2,500

$55.973

$50.935

$45.898

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A-Z Elektronik GmbH

Germany . 9,504 parts In-Stock

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9,504

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Alle Elektronik GmbH

Germany . 3,999 parts In-Stock

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Kepictronics

USA . 2,880 parts In-Stock

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Perfect Parts

USA . 1,281 parts In-Stock

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Assy Fe

Spain . 1,100 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 557 parts In-Stock

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557

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ChipstoGo Electronic ltd

UK . 90 parts In-Stock

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90

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Overview

Experience seamless and efficient data communication with the DP83816AVNG by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This Serial Communication Controller is perfect for applications such as Ethernet communication and LAN peripherals. With a maximum data transfer rate of 12.5 MBps and low power mode, this product offers tremendous value and benefits to customers seeking fast and reliable communication solutions. Trust Texas Instruments to deliver cutting-edge technology that meets your needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, offering flexibility in system design.

Address Bus Width: 32

A wide address bus width of 32 bits enables the controller to access a large memory space, improving processing capabilities.

Package Shape: SQUARE

The square package shape provides stability and easy mounting on the PCB, ensuring secure placement and reliable connection.

Power Supplies (V): 3.3

The standardized power supply voltage of 3.3V makes it compatible with various systems and power sources, enhancing versatility.

No. of Terminals: 144

With a high number of terminals, the controller can support multiple connections and components, enabling complex communication setups.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style ensures space-saving design and efficient heat dissipation, enhancing overall performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3V ensures reliable operation even under low power conditions, improving power efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the controller to function effectively in various environmental conditions, increasing versatility.

Maximum Data Transfer Rate: 12.5 MBps

The high data transfer rate enables rapid communication between devices, reducing latency and improving overall system performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in cold environments, enhancing the controller's overall reliability.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring secure connections and long-term durability.

Terminal Position: QUAD

The quad terminal position allows for easy connection and efficient layout on the PCB, simplifying assembly and maintenance processes.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6mm enables the controller to fit in compact spaces and slim devices, offering design flexibility.

Width: 20 mm

The compact width of 20mm ensures that the controller can be integrated into a wide range of devices without taking up too much space.

Data Encoding or Decoding Method: NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Multiple data encoding and decoding methods enhance compatibility with various protocols and communication standards, ensuring seamless data transfer.

External Data Bus Width: 32

The wide external data bus width of 32 bits allows for high-speed data transfer and processing, improving overall system performance.

Communication Protocol: ETHERNET

Support for the Ethernet communication protocol enables seamless network connectivity and data exchange, making the controller suitable for networking applications.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz facilitates fast data processing and communication, enhancing system responsiveness.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures excellent solder joint reliability and durability during manufacturing and assembly processes.

Length: 20 mm

The compact length of 20mm allows for easy integration into space-constrained devices and systems, enhancing design flexibility.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard environmental conditions, making the controller suitable for a wide range of applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, LAN

The peripheral IC type enables the controller to support serial IO and LAN communication, making it versatile for various networking and data transfer applications.

Technology: CMOS

The CMOS technology used in the controller offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly, ensuring reliable connections and long-term performance.

Maximum Supply Current: 140 mA

The low maximum supply current of 140 mA results in lower power consumption and heat generation, contributing to energy efficiency and extended lifespan.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and reliable operation, protecting the controller from voltage fluctuations and power surges.

Bus Compatibility: PCI

PCI bus compatibility allows for seamless integration with PCI-based systems, ensuring easy connectivity and communication with a variety of devices.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density mounting and compact PCB design, suitable for applications where space is limited.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the controller is sensitive to moisture exposure during storage and handling, requiring proper precautions to prevent damage.

Low Power Mode: YES

The low power mode feature allows the controller to operate in a power-efficient state, reducing energy consumption and extending battery life in portable devices.

Technical Specifications

Serial Communication Controllers DP83816AVNG attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

25 MHz

Communication Protocol:

ETHERNET

Data Encoding or Decoding Method:

NRZ; NRZI; BIPH-LEVEL(MANCHESTER)

Maximum Data Transfer Rate:

12.5 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e0

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

1

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Current:

140 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

DP83816AVNG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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